2004D multi-purpose dispensers combine 3-axis robots with digital dispense controllers for SMT assembly tasks. Provide point-to-point, linear, or curved-arc application of solder pastes, solder masks, conductive epoxies, and other adhesives. Benchtop units weigh fewer than 100lbs.; can store up to 10,000 different dispensing routines created through the use of a handheld teach pendant. Can import CAD and graphics file formats and 3D interpolation of arc and line data points. Feature high-torque drive mechanism for speeds to 800mm/sec. and linear guide rails for a repeatability of ±0.01mm per axis. Have 100mm of z-axis stroke and braking system that can hold up to a 6kg payload without power.
Manncorp, www.manncorp.com
MV-9 SIP is configured with Omni-Vision 2D/3D technology for semiconductor inspection. Combines 25Mp CoaXPress 2D ISIS vision system with digital multi-frequency quad Moiré 3D system for inspection of semiconductor assemblies. Features four 10Mp side-view cameras and 25Mp top-down camera. MP-7 Micro is designed for BGA ball inspection. Is configured with 15Mp ISIS vision system, a 6µm telecentric compound lens and color strobe LED lighting.
Mirtec, www.mirtec.com
Sigma G5JS single-beam mounter implements overdrive technology for utilization of front and rear resources via a single placement head. Head can be high-speed (up to 44mm square single shot recognition) or multifunction. Head is rated at 37,500 cph; multi-function head is rated at 7,000 to 9,000 cph for chip components, excluding transition time of approx. two sec. Can choose from three different tray feeders.
Hitachi High Tech Instruments, http://www.hitachi-hta.com
SM3320S-S single table, SM3350S-D twin table and SM4520L-D twin table floor-mounted printed circuit board depaneling routers feature built-in high-res color CCD cameras with 20x magnification. Program cutting path with controls that are saved, edited and copied. Vision system is included to check fiducials before cutting starts or can be turned off. Precision ball-screw and linear guides maintain repeatability of ±0.03mm. Offer dust collection from the bottom with a built-in ionizer and a safety shield.
Fancort Industries Inc., www.fancort.com
Amtech VS-213 no-clean, lead-free solder paste formula is halogen-free based on all testing methods, including oxygen bomb combustion and ion chromatography. Is said to be environmentally friendly and fully compliant with ROHS 2011/65/EU. Helps prevent voiding when soldering LGA, BGA, CSP and QFN packages. Wets easily, has long stencil-life, and 16-hour abandonment time. Thermally stable at temperatures up to 300oC. Meets highest IPC 7095 voiding performance classification of Class 111. ROL0 flux classification. Post-reflow residue said to be nonconductive and noncorrosive.
SMT International, www.amtechsolder.com
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