Fine-L-Kote high viscosity AR acrylic conformal coating reportedly widens the process window and flexibility. Can use as-is for dipping or thin down for spray systems. Is for selective spray systems both atomized and airless. Designed with high solids content. For high-speed coating of automotive electronics, consumer electronics, etc.
Techspray, www.techspray.com
NC273LT solder paste for Bi-containing alloys is designed for low-temperature applications. Activator system said to improve wetting performance of bismuth alloys to RoHS-compliant plating and surface finishes. Reportedly offers excellent transfer efficiencies, long stencil life and minimizes solder balling.
AIM, aimsolder.com
NC520 no-clean, halogen-free solder paste is for high-density electronics assemblies. Is said to offer excellent wetting, improved printing and reduce voiding. Results in bright, smooth and shiny solder joints. Consistent transfer efficiencies reduce head-in-pillow defects even when component/substrate coplanarity is not optimal.
AIM, aimsolder.com
CI-1062 conductive silver ink, for circuitry fabrication on wearable substrates, is said to cure in three minutes at 120°C. Provides print performance, and is compatible with many TPU and similar wearable films.
Engineered Material Systems, www.conductives.com
Parallel Link Robot is an easy-to-program, automated six-axis robot for various manufacturing applications including insertion, wiring, assembling, adhesive application, soldering, and labeling. Simple, direct teaching process uses hand-guided intuitive operation to replicate precise human motion. Doesn’t require typical engineering skills and computer work to program. Once programmed, can run 24 hours a day.
Panasonic Factory Solutions Company of America, www.panasonicfa.com
The Handbook of Electronic Assembly and A Guide to SMTA Certification, authored by Ronald Lasky, Ph.D., James Hall, Katherine Hickey and Jennifer Tate, Ph.D. is a reference manual for process engineers in electronics and those new to the industry. Provides in-depth view of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test. Originally conceived as a supplement to the SMTA Certification Program. 81 pages.
SMTA, www.smta.org
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.