γ-S330 inline SL/SR PCB separator is fully loading and unloading. A two-way sliding work exchanger limits idle time and simultaneously loads and unloads. Includes 10X CCD camera to minimize programming time and auto-fiducial mark point check and cutting route auto compensation to ensure accuracy.

Aurotek, robot.com.tw

CXP (Convection Expandable Platform) is for surface characterization of PCB local areas under reflow conditions. Is applicable for IPC-9641 concerning warpage measurement of PCB surface mount regions. Software compares warpage results to corresponding component warpage.

Akrometrix, www.akrometrix.com
 

M8000 Series BER is a highly integrated and scalable bit error ratio tester for physical-layer characterization, validation and compliance testing. Is said to enable fast, accurate receiver characterization of single- and multilane devices operating at data rates up to 16 Gb/s and 32 Gb/s. Streamlines receiver test setup. Offers built-in jitter injection, 8-tap de-emphasis, interference sources, reference clock multiplication, clock recovery and equalization. Automates in situ calibration of signal conditions. Is scalable and expandable. Supports one to four BERT channels and offers data rates of up to 8.5 Gb/s and 16 Gb/s with an extension to 32 Gb/s. Based on AXIe.

Agilent Technologies, www.agilent.com

NanoSlic Gold stencil, for solder paste printing, has a coated stencil underside and aperture walls, making them highly hydrophobic and oleophobic in order to repel solder paste. Coating is thermally cured and permanent, and said to improve solder paste transfer efficiencies for small apertures, resulting in higher yields and less rework. reportedly minimizes bridging and reduces underside cleaning. Is compatible with current assembly equipment and processes.

FCT Assembly, www.fctassembly.com