Solderon BP TS 6000 tin-silver plating chemistry is for use in Pb-free solder bump plating applications. Is capable of plating speeds ranging from 2 to 9µm/min. Has an Ag composition. Is reportedly robust for bumping and capping of patterned wafers; is not restricted to specific photoresists. Exhibits with-in die uniformity after reflow of <5%. Is macro- and micro-void free after reflow. Is electrolytically and thermally stable. Offers electrolytic bathlife of >100 Ah/L and a ≥6-mo. pot life; is compatible with inline metrology processes.

Dow Electronic Materials, www.dowelectronicmaterials.com

LV1000 low-voiding flux coating is for solder preforms. Is halide-free and is reportedly suited for assembly processes in which components don’t allow for proper outgassing of volatized flux. Provides a clear coating; doesn’t clog pick-and-place equipment. Has weight percentage as low as 0.5%. Is applied to the outside of the preform where flux is required.

Indium Corp., www.indium.com

LV1000 low-voiding flux coating is for solder preforms. Is halide-free and is reportedly suited for assembly processes in which components don’t allow for proper outgassing of volatized flux. Provides a clear coating; doesn’t clog pick-and-place equipment. Has weight percentage as low as 0.5%. Is applied to the outside of the preform where flux is required.

Indium Corp., www.indium.com

EVS 500 dross recovery machine dispenses with air-driven pistons and inverts solder/dross separation pot. Adds 180° rotating facility. No teeth are used to separate solder/dross. Is fully automatic. Offers same safeties and locking systems of EVS 8K/10K models. ISO 14001 compatible. Can help reduce dedrossing time by 75% and waste dross off-site by up to 85%.
   
EVS International, www.solderrecovery.com