Series 6 x-ray inspection system includes hexaglide manipulation for manual and semi-automated inspection. Supports universal sample trays; inspects electronic components (e.g., double-sided printed circuit boards) and complete modules, as well as casting parts and medical implants. Can be equipped with automatic load/unload unit or for CT configuration. Permits flexible movements on all axes based on parallel-kinematic hexapod manipulation unit. Six axes motion unit can be moved via space mouse navigator in vertical and horizontal direction and around 180°. Inspects dimensions up to 400 x 400mm and has an XL configuration for up to 550 x 550mm as an option. Can be equipped with different x-ray tubes up to 160kV. Provides up to four x-ray images per sec. in transmission mode.

MatriX Technologies, www.m-xt.com

TC-2030 and TC-2035 thermally conductive adhesives were developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. Are two-part, heat-cured silicone technologies. TC-2030 has a thermal conductivity of 2.7 W/mK. Reportedly provides improvement in elongation performance. Has bond line thickness of 130µm. TC-2035 helps manage heat in automotive applications, including power electronics. Has 3.3 W/mK thermal conductivity and BLT as low as 50µm. Bonds to thermal substrates, including direct bonding copper, high-density interconnect, low-temperature co-fired ceramic and printed circuit boards. Sustains performance at temperatures reaching 200°C.

Dow Corning, www.dowcorning.com
 

TC-2030 and TC-2035 thermally conductive adhesives were developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. Are two-part, heat-cured silicone technologies. TC-2030 has a thermal conductivity of 2.7 W/mK. Reportedly provides improvement in elongation performance. Has bond line thickness of 130µm. TC-2035 helps manage heat in automotive applications, including power electronics. Has 3.3 W/mK thermal conductivity and BLT as low as 50µm. Bonds to thermal substrates, including direct bonding copper, high-density interconnect, low-temperature co-fired ceramic and printed circuit boards. Sustains performance at temperatures reaching 200°C.

Dow Corning, www.dowcorning.com
 

LED Mounter JX-300LED has a larger printed circuit board size capacity and improved placement speed. Is capable for production of max. 1200mm PCBs. As an option, it can produce max. 1500mm PCBs.  Can place light diffuser lens by using laser sensor to identify boss on the lens to determine the correct direction. Mid-size LED components can be placed in 19,300 CPH, with 12mm tape feeder, 6 nozzle alternate placement by 3 nozzle simultaneous pick (two times). Is capable of PCB size 610 x 360mm by one time clamp, 1200 x 360mm by two times clamp, and 1500 x 360mm by three times clamp.

Juki, www.juki.co.jp