Mini Wave Selective process measurement instrument now comes with flux measurement system to monitor flux position accuracy during daily benchmarking of machine performance. Includes precision sensors and complimentary measurement circuits to permit flux to be easily assessed. Detects flux presence and position verification when sprayed upon an assembly. Sensor heads made of titanium or high-temperature thermoplastics. Provides a "one pass" platform for measuring X and Y speed, solder temperature, preheat profiles, contact time and flux positioning verification.
SolderStar, www.solderstar.com
DF-2000 series dry film negative photoresists are for hot roll lamination and processing on MEMS and IC wafers. Were developed for consistent photo speeds with +/- 3% critical dimension target. Are available in thickness formats from 5 to 50µm, +/- 5%. Have a glass transition temp. of 145°C and a moderate modulus of 4.5 GPa at 25°C. Are hydrophobic and compatible with the EMS line of spin coatable photoresists.
Engineered Material Systems, www.emsadhesives.com
DF-2000 series dry film negative photoresists are for hot roll lamination and processing on MEMS and IC wafers. Were developed for consistent photo speeds with +/- 3% critical dimension target. Are available in thickness formats from 5 to 50µm, +/- 5%. Have a glass transition temp. of 145°C and a moderate modulus of 4.5 GPa at 25°C. Are hydrophobic and compatible with the EMS line of spin coatable photoresists.
Engineered Material Systems, www.emsadhesives.com
Micro Fine soldering iron tips are designed for soldering small components, even on dense boards. Tip sizes range from 0.1 to 1mm. Are available for EB9000S soldering station and EB2000S station; can be used with STTC/SMTC.
EasyBraid Co., www.easybraidco.com
Sigma G5S modular mounter offers a placement speed up to 75,000cph, high-speed head accuracy down to 25µm, and multifunction head accuracy down to 15µm. Can accommodate max. board sizes of 610 x 510mm. Can be equipped with self-loading SL component feeders. Is available in High Speed and Flexible High Speed configurations. Features a two-head placement system; two quick-change feeder bases that accommodate tape and stick feeders or quick-change tray unit with tape feeders, and an Overdrive Control System; both heads can pick from each other’s component supply and place on the same board simultaneously. Max. height for multifunction head is 35mm; insertion force for multifunction head is 100N.
Hitachi High Tech Instruments, www.hht-eu.com
PrinTEK SMT stencil printer now features four CAMs driven directly by a solid steel gear rack. Design is seamlessly integrated within the base of the machine and also features a fluid damper and precision adjustment knob. Is said to improve control over the Z-height adjustment.
Transition Automation, www.transitionautomation.com
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.