Eccobond UV9060F and EN3707F encapsulants reportedly provide barriers to environmental influences. Protect against contaminants like moisture and fluids, such as beverages and perspiration. Designed for high-UPH production environments, they cure with UV light in fewer than 30 sec.; contain cure mechanism to ensure shadowed areas not exposed to UV light are fully cured. UV9060F has a secondary moisture cure. A secondary thermal cure is built into EN 3707F. Both can be applied via non-contact dispensing or traditional needle dispensing. Include fluorescent tracer; exposure to black light illuminates fluorescent tracers.

Henkel, www.henkel.com/electronics

Technical Electronic Workstations are ergonomically designed. Have flexible standard components and accessory options above and below the work surface. Can be custom configured for height and length, as well as leg and pedestal supports, including Tech Leg, Tech Panel Leg, mobile bases, and cabinet pedestals. Many configurations feature a built-in electrical power supply on either an instrument riser or as part of the Nexus accessory system. Can choose from static-safe components, including ESD paint, work surfaces and shelves, conductive plastic boxes, and grounding accessories. Modular drawer storage cabinets can serve as pedestals.

Lista International, www.listaintl.com

X3L 3D inline x-ray inspection system comes with dual detector, combining a line-scan for transmission inspection of PCBs in a few sec. and a high-res digital flatpanel detector for selective 3D image capturing. Offers transmission, off-axis image capturing, and 3D-SART. Uses a readout TDI camera (line scanner) in parallel, reducing image capturing for 18x16" PCBs to fewer than 10 sec. 3D-SART (simultaneous algebraic reconstruction technique) provides slice images for solder joint analysis. Uses MIPS platform with links to MIPS software modules for programming, classifying and verification. MIPS verify now supports defect image verification with an extended 3D functionality.

MatriX Technologies, www.m-xt.com

LTS 300 is an automated hot dip solder lead tinning system for reconditioning plated through-hole, SMT and QFP components. Reportedly ensures compliance with RoHs and reliability requirements. Combines three tinning processes in one machine; performs a dip process for through-hole components, a drag process for chips and LCCs, and is equipped with a vacuum-articulated spindle for tinning QFP leads. Applications include refurbishing legacy components; gold embrittlement mitigation; tin whisker mitigation; converting RoHS components to Sn/Pb and vice versa; solderability testing, and BGA cleansing. Employs a dip process for T/H components, using a flat wave solder nozzle, working in conjunction with pallets that hold the components in position. A pallet of components moves to the flux station, followed by preheating, then to the first solder pot to remove coating. A side-to-side motion provides a scrubbing action to help dissolve plating into the scavenging alloy. Pallet returns to flux station, where leads are fluxed and conveyed to second solder pot for intermetallic coating.

ACE Production Technologies Inc., www.ace-protech.com