FuzionXC2-37 and FuzionXC2-60 reportedly have more than twice the feeder inputs of other surface mount machines. Have NPI software tools featuring icon-driven interface and efficiency tools, including online component auto-teach and on-the-fly production editing. Ion feeders have top-loading design that reportedly reduces replenishment and changeover times by 50%. Combine high-speed chip to odd-form placements – from 01005 passive components up to 150mm connectors – with 5kg placement force and parts up to 25mm tall. FuzionXC2-37 accommodates boards up to 1300mm x 610mm, 272 8mm feeder inputs, and input types including strip, tape, tube, odd-form, and tray. The FuzionXC2-60 has 264 8mm feeder inputs.
Universal Instruments, www.uic.com
Super Gel 9 urethane-modified epoxy gel can be used for encapsulation of electronic parts and sealing optical components. Has Shore A hardness of about 5-10. Is reportedly ideal for retrieving components with a knife or razor blade. Can withstand rigorous thermal cycling and thermal/mechanical shock. Has two-to-one mix ratio by weight or volume, along with a low viscosity and exotherm enabling it to be cast in sections up to 2"-3" thick. Bonds to metals, glass, ceramics and many rubbers and plastics. Has working life of 7-9 hr. Resists water, oils and fuels. Service temp. range is -100° to +200°F. Is available in ½ pints, pints, quarts, gallons, 5 gal. container kits and gun dispensers.
Master Bond, www.masterbond.com
RO-Control and RO-Soft 7 software simulate, control and document RO300 and RO400 series reflow and curing ovens and processes. RO-Control 7 controls and regulates oven parameters such as zone temperatures, feed rate and conveyor width. Automatically set up certain ovens and start production. Status messages displayed graphically, and incoming and outgoing boards are monitored. Auto-save feature regularly captures temperature and speed values in a CSV type file. Operator actions are logged, and software modules can be released to specific individuals. Based on temperature settings, product data and throughput expectations, RO-Control simulates expected temperature profile, and graphically compares to measured values and solder paste specifications. Both packages measure real temperature profiles directly on the PCB using thermocouples. Multiple measurements can be overlaid to detect deviations. All data can be exported as CSV and graphics. Both packages require Windows 7 and can be upgraded from older versions. Language support now includes Polish.
Essemtec, www.essemtec.com
RO-Control and RO-Soft 7 software simulate, control and document RO300 and RO400 series reflow and curing ovens and processes. RO-Control 7 controls and regulates oven parameters such as zone temperatures, feed rate and conveyor width. Automatically set up certain ovens and start production. Status messages displayed graphically, and incoming and outgoing boards are monitored. Auto-save feature regularly captures temperature and speed values in a CSV type file. Operator actions are logged, and software modules can be released to specific individuals. Based on temperature settings, product data and throughput expectations, RO-Control simulates expected temperature profile, and graphically compares to measured values and solder paste specifications. Both packages measure real temperature profiles directly on the PCB using thermocouples. Multiple measurements can be overlaid to detect deviations. All data can be exported as CSV and graphics. Both packages require Windows 7 and can be upgraded from older versions. Language support now includes Polish.
Essemtec, www.essemtec.com
VT-X700 inline, automated 3D CT x-ray analyzes printed circuit boards, including those with hidden solder joints. Inspects solder quality on components from BGAs to chips, and through-hole devices. Inspections are performed at 5 sec. per field-of-view. Gauges PCB surface for each solder joint, compensating for warpage; performs cross-sectional analysis at slice-level locations. Has selectable resolutions of 10, 15, 20, 25 or 30µm combined with selectable numbers of x-ray projections (up to 128).
Omron, www.omron247.com/
VT-X700 inline, automated 3D CT x-ray analyzes printed circuit boards, including those with hidden solder joints. Inspects solder quality on components from BGAs to chips, and through-hole devices. Inspections are performed at 5 sec. per field-of-view. Gauges PCB surface for each solder joint, compensating for warpage; performs cross-sectional analysis at slice-level locations. Has selectable resolutions of 10, 15, 20, 25 or 30µm combined with selectable numbers of x-ray projections (up to 128).
Omron, www.omron247.com/