Circuits Assembly Online Magazine - Features

Mini-Oven Reball/Solder Bumping unit 04 provides controlled air circulation; hot air continually flows around the component, heating it equally from all sides. Offers programmable modes and a nitrogen process gas supply for minimizing solder oxidation. Up to 99 profiles can be stored, with the ability to edit individual profiles and fine-tune parameters. Reballing function is capable of handling diverse range of BGAs, as well as QFNs and CSPs. Rapid Technology soldering profiles apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates, and maintain a safe temperature zone. Is ideal for the complete QFN solder bumping process. Uses Hotprint Technology; mask remains on the QFN during reflow.

Martin, www.bgarework.com

16.350 wave solder machine can be configured with two pots on rollout carts to provide lead and Pb-free soldering. Solder pot capacity is 200Kg. Is fewer than 5.5’ long and includes 350mm-wide adjustable finger conveyor with built-in cleaner and a 600mm preheat tunnel with forced hot air convection. Features motorized inlet conveyor and motorized spray to evenly distribute flux.

Manncorp, www.manncorp.com

No. 952 550°F electrically-heated forced-air convection bench oven is for programmed heat processing. Workspace dimensions measure 26" x 22" x 16". 3kW installed in Incoloy-sheathed tubular elements provide heat to the workload, while a 1/80-HP recirculating blower creates a convection air movement in the chamber. Features 3" insulated walls, an aluminized steel exterior, Type 430 stainless steel interior, and an integral oven stand. Includes programmable and recording temperature controller, with 10" diameter circular chart, plus a manual reset excess temperature controller with separate contactors.

The Grieve Corp., www.grievecorp.com

GlobalTech SmartWipes contain Isopropyl alcohol in two different formulations, with two wipe substrate materials. Are available in a 70/30 blend with deionized water and as 99.8% to 99.9% pure IPA; are available with a 100% polyester wipe material. Are also available with an industrial grade wipe material made from a blend of natural and synthetic fibers. Incorporate a high-grade alcohol coupled with a Class 100 cleanroom nonwoven material for use in electronic screen and stencil printing applications or for use around electronic components and assemblies. Can be used to remove soils such as solder paste, flux residue, conformal coatings, screen printable inks and chip bonder epoxies. Industrial-grade IPA wipes are made from a blend of fibers designed to hold up to rigorous cleaning and wiping applications; can be used to wipe down mechanical assemblies, machinery, tools, equipment, production parts, countertops, and workbenches.

JNJ Industries, www.jnj-industries.com

Sarcon 50G-Hm is a high-performance, low-resistance gap filler pad manufactured with a low-tac top surface. The one-sided treatment is reportedly less sticky than the opposing surface; thermal pad adheres to target electrical component or opposing heat sink. Provides removal without ripping, warping or damaging the interface material. Transfers heat with a thermal conductivity of 6.0 W/m°K and a low thermal resistance of .16°Cin2/W at 72.5 PSI. This 0.5mm-thick, flame-retardant TIM is available in sheets up to 300mm x 200mm.

Fujipoly America Corp., www.fujipoly.com