New packaging and labels are available for DMP6-10, DMP8-10 and DMP16-10 inserts. Packaging provides enhanced protection of the DMP inserts during shipping and handling. Prevents contaminants from coming in contact with DMP insert assemblies during storage. Each package has two labels, one affixed to the box and one attached to the inside bag. Labels contain part numbers, descriptions and lot numbers for tracking purposes.

Techcon Systems, www.techconsystems.com

Micro-Coil Spring Array is an alternative to standard rigid arrays. Designed to replace column grid array (solder columns) commonly used on ICs with high lead counts. Is a drop-in replacement for BGA column grid array packaging applications that require greater reliability and long-term robustness. Developed by NASA.

STI Electronics Inc., www.stielectronicsinc.com

I-prober 520 positional current probe observes and measures current in printed circuit board and other conductors without the need to break or surround the conductor. Used with an oscilloscope, this compact, handheld probe provides a bandwidth of DC to 5 MHz and a dynamic range of 10 mA to 20 A pk-pk. When user places insulated tip onto the conductor, the current flowing in the track can be observed and measured. Operates by sensing the field in close proximity to the track. Employs miniaturized version of a fluxgate magnetometer. Has a safety rating of CAT II, 300 V (CAT I, 600 V) and is suitable for connection to any 1-MΩ input of an oscilloscope. Comes with control box and calibrator, power supply, and a clip-on toroid assembly.

Aim-TTi, www.tti-test.com/products-tti/precision/iprober520.htm

ScanExpress boundary-scan tool suite v. 7.6 CD includes JTAG embedded test support for AMD Family 10 processors; enables processor emulation-based testing capabilities on AMD ASB2 (BGA), Opteron 4100, and Quad-Core Opteron CPUs. Integrates with National Instruments’ high-speed digital I/O (HSDIO) hardware. Supports 655x series of digital instruments with JTAG test clock (TCK) rates of up to 30 MHz. Other improvements include new test scripting functions and features, including direct JTAG scan functions, global script variables, and test time stamping; new pin direction constraints for TPG’s test vector generator; overhauled topology viewer, including a visual representation of all components on the scan chain, including series resistors, and test connectors; support for Blackhawk XDS560v2 series JTAG controllers, and JTAG embedded test support for Freescale i.MX51 and Texas Instruments’ AM/DM37x processors.

Corelis, www.corelis.com/education/JTAG_Boundary-Scan_Seminars_and_Training.htm