Halogen-free flame retardant tapes are dimensionally stable, engineered tapes specifically designed to help prevent the propagation of flames in a variety of applications. Are tested to the UL94 standard. Use FlameGard technology, which combines chemical and physical mechanisms to control heat transfer, oxygen availability, material decomposition and the generation of flammable gasses. Flame retardant single coated tapes are available in 0.001" and 0.002" polyimide and 0.002" polyester films, and 0.002" aluminum foils. Adhesives and liners are offered with a combination flame retardant/static dissipative construction.
Polyonics, www.polyonics.com
SFX-9305/R is an I/O module within the frame of Scanflex boundary scan hardware. Provides five ports for the universal test of industrial interfaces, which can be electrically isolated per relays. Can combine functional test procedures for bus interfaces such as LAN, USB, CAN or LIN with vector-less working test methods. Provides five independent, freely configurable bus ports. Target is physically accessed by a selection of bus access cables. Current configuration is automatically identified, whereby BAC type and quantity are freely definable. Number of available bus ports is nearly unlimited. Supported interfaces are LAN (10/100/1000), USB 2.0 (Host/Slave), Bluetooth, CAN (high-speed/low-speed), LIN, RS232 and RS422/458. Additional interfaces are being developed. Available interface functions contain the step-wise handling of protocol layers, including bidirectional data transfer.
Goepel electronic, www.goepel.com
891 and 893 64-position, 1mm pitch mezzanine connectors are for parallel board stacking interconnections. Surface mount connectors have a mated height of 10mm. Provide high-density packaging. Locating posts are incorporated into housing to promote accurate placement on the PCB. Are RoHS compliant and suitable for Pb-free reflow soldering processes. Packaging is tape and reel, per EIA-783 (56mm wide; 16mm pitch). Feature 30u" gold-plated contacts. Insulator housings are made of high-temperature glass-filled LCP, rated UL 94 V-0. Meet EIA-700 AAAB specifications for IEEE 1386 applications. This standard can be found on VME, VME64 and VME64X boards, CompactPCI boards, Multibus I and II boards, desktop and portable computers and servers; can also be used as modular connectors for front panel and backplane I/O cards.
Mill-Max, www.mill-max.com/PR623
Through-hole connection system kits come in 0.8mm, 1mm and 1.2mm sizes. Involve a simple manual process for conductivisation of holes in circuit boards. Help achieve plated through-holes on PCBs without investing in an electroplating system. Ensure flat finish on both sides of the hole. Contain tooling and bails for 250 holes, one size per pack. Additional packs of 10 bail-bars are available. Operate by applying a conductive coating to the walls of a circuit board hole, while maintaining a flat surface on both sides. Holes are left with a solder-plated copper wall and a solder-filled barrel. If a through-hole is not required, top and bottom pads are soldered. Where a through-hole is necessary, the solder core is removed with a de-soldering tool or wick after soldering both sides. Holes are left with a tin-plated electrolytic-quality copper sleeve pressed into the hole walls. Bail-bars consist of lengths of solder wire, which have been electroplated with pure copper, then over-plated with tin and scored at intervals of approximately 2mm. Each bail-bar is divided into 25 bails. End of the bail-bar is inserted into the hole using an insertion tool; bail-bar is snapped off to leave one bail in the hole. An automatic snap punch is placed over the end of the bail and pressed down. Hole may be de-soldered if a clear through-hole is required. Components in kit: insertion tool; punch; 10 bail bars (250 holes); five appropriately sized drill bits, and anvil.
Satcam, www.satcam.com
MDO4000 series oscilloscope has a built-in spectrum analyzer. Can capture time-correlated analog, digital and RF signals simultaneously. A single instrument correlates events in the frequency domain with the time domain phenomena that caused them. Provides system-level debugging of wireless-enabled designs; can be used for timing analysis for mixed domain designs and tracking the source of noise or interference.
Tektronix, www.tek.com
WaveMax 8000 is a woven glass fabric, combined with a high-temperature static dissipative epoxy resin. Offers excellent mechanical strength at continuous operating temp. in excess of 180ºC. Designed for wave soldering and IR reflow applications; can endure temp. approaching 300ºC for short periods without adversely affecting the life of the material. Reportedly offers more uniform ESD properties and superior machining capabilities over other comparable materials. Has thin walls easily machined. Retains static dissipative properties.
Norplex-Micarta, www.norplex-micarta.com