Pneumatic Servo Dispensing system is a positive rod displacement metering system that reportedly eliminates the need for a servo drive motor or material flow meters. Integrates a pneumatic drive motor and servo package to provide precise metered volumes, accurate flow control and consistent bead profiles. Pneumatic cylinder and positive displacement meter are lightweight and assembled into a single compact metering module for floor, robot or pedestal mounting. Components are readily accessed and easy to maintain. Is operated by a PSD control panel or automation integrated controls with dispensing software. Is ideal for adhesive bonding, casting, filling, gasketing, molding, sealing, and other operations. Is designed to dispense adhesives and sealants such as one-part epoxies, mastics, silicones, urethanes and abrasive materials. Includes supply pumps and a dispense valve available in Tip-Seal, No-Drip and Snuf-Bak models.

Sealant Equipment & Engineering, www.SealantEquipment.com/PSD

XSD Series desiccant cabinets are oxidation-free drying and storage systems for moisture-sensitive devices. Are designed to exceed J-STD-033B.1 for MSD handling. Combine low humidity and mild temperatures to replace vacuum oven-baking of tape-on-reel components. Dry PCBs and other MSDs at high speeds, reportedly without oxidation and intermetallic growth. XSD 1400 and XSD 700 series cabinets employ a dual-wall insulated steel and glass design, and the U5002 Dynamic Series closed loop Zeolite dryer. Maintain humidity levels below 0.5%RH and vapor content less than 0.6g.m³. Energy consumption averages less than 30W/hr.

Totech Super Dry, www.superdry.info

DB-1580 series conductive stringer attach adhesives are for back contact applications in crystalline silicon solar modules. Are designed to make contact from vias or other conductors in the solar cells to the back contact sheet. Are stress absorbing and have excellent conductive stability to back contact metallizations during damp heat exposure. Are designed to cure through the encapsulant lamination and cure process. Fast cure versions are available for co-curing with fast laminating encapsulants.

Engineered Conductive Materials, www.conductives.com

A-Series Hybrid targets manufacturers in the semiconductor backend industry. Introduces parallel placement technology to applications like SiP, MCM manufacturing, and flip chip bonding. Includes programmable placement force control. Has fluxer dip station and high-accuracy cameras. Can bond flip chips at a repeatability of 10 µm, while placing at 2,500 components per hr. per single placement head. Die bonding speeds are 3,500 cph per head at 25 µm, while passives are placed at 8,000 cph at 40 µm. Can carry up to three specialized twin placement robots, holding two heads per robot, for a total flip chip bonding speed of 15,000 placements per hr. per machine. Can also carry conventional placement robots for chip shooting for passives as small as 01005.

Assembléon, www.assembleon.com