MFR-1300 standalone desoldering equipment builds on existing MFR technology. New design permits hand piece to be used in two configurations. Can swap grip on hand piece from standard pencil grip to pistol grip. Power supply features internal pump that provides 0.7 bar (21" Hg) of vacuum suction force, combined with Smartheat technology. Has dual switchable output; can operate one or two different hand pieces. Includes replaceable collection chamber. Solder collection capabilities reportedly have been increased 40% from previous MFR desoldering systems.

OK International, www.okinternational.com

DT85M Series 3 Data Logger is for remote monitoring. Features cellular modem. Backlit LCD display shows channel data, alarms, and system status, navigable with six-button keypad. Features temperature operating range of -30°C to 70°C and up to 85% RH. Construction is powder-coated steel and anodized aluminum. Design (peak power 12W) permits use of a smaller solar panel. Enables automatic data delivery. Can send logged data to an FTP server. Internal storage capacity is 128MBs; has removable USB storage device support. Configurable alarm conditions can be used to trigger data delivery and send alarm messages to multiple email addresses or mobile phones. Features 16 analog input channels, expandable up to 320 channels and 960 analog points using optional CEM20 modules, as well as 12 flexible digital channels. Has up to 48 analog sensor inputs with two serial smart sensor ports. Fundamental inputs include voltage, current, resistance and frequency. Supports thermocouples, RTD, thermistors, monolithic temperature sensors, and 4-20mA. Maximum sample speed is 25Hz with 18 bits of effective resolution. Modbus is supported for SCADA connection, as well as multiple SDI-12 interfaces for environmental sensors. dEX graphical interface comes preinstalled.

CAS DataLoggers, www.DataLoggerInc.com

C245 Super Cartridges are for high thermal efficiency. Permit T245 hand piece station to supply the most power possible to the solder joint. Bottleneck is usually the tip of the cartridge.

JBC Tools, www.jbctools.com

OptiCon X-Line 3D x-ray inspection system enables a safe quality control of solder joints on opposed mounted BGA components, such as in double-sided equipped DDR-RAM modules. Single-sided and double-sided equipped PCBs can be inspected within one test run. Can analyze both top and bottom sides of boards and all layers in between layer by layer. Each BGA solder ball is localized in x/y-direction, as well as z-direction. Relevant parameters of each solder joint are determined in three layers. Open solder joints and wetting defects can be detected; voids can be determined in size and z-position within a solder joint. Is able to detect solder connections at IC pins and two-pin components, as well as THT components. Uses GigaPixel image technology. Real-time multi-angle image recording enables a test speed of 40cm²/s for full 3D PCB capturing. Integrated reconstruction methods, based on digital tomosynthesis, allows defined evaluation of single layers.

Goepel electronic, www.goepel.com