CheckMate Stockroom software keeps track of inventory items by location. Can track inventory in the main stockroom, as well as multiple other locations. Tracks inventory by multiple units of measure (each/ml/in²) and records lot numbers, serial numbers and expiration dates. Reports provide replenishment information and usage. When used with CheckMate JobData Job Tracking and ToolroomTool/Equipment Tracking, it becomes a production management system. Can create manufacturing orders, bills of materials, and sales orders. Jobs can be tracked through production, and labor and parts cost against the job.

Dynamic Systems, www.a-barcode.com

Vision Mini smart camera is designed for embedded clinical and lab automation applications. Automates critical inspection tasks such as cap presence, color matching, and test tube identification, in addition to reading 1D and 2D barcodes. Measures 1.8" x 2.1" x 1"; permits flexible positioning in tight spaces. Features fully integrated lighting, autofocus lens, AutoVISION software tool set, and wide angle optics for close-range applications.

Microscan, www.microscan.com

Fanuc M-1ia is a lightweight, compact robot designed for small part handling, high-speed picking and assembly applications. Parallel-link structure reportedly provides higher speeds and accuracy compared to traditional assembly robots. Is available in two models (4- or 6-axis) for various applications and can be installed in multiple orientations. Is also available in three configurations, including robot-only (no stand), desktop mount with stand, and ceiling and angle mounting. Can be mounted to taping equipment. Enables part feeding from the sides of a work zone. Has R-30iA Mate rack-style controller.  Detachable color-graphic iPendant or monochrome pendant can be shared between multiple robots on the same assembly line.

Q Corp., www.qcorporation.com

3DIR metrology system includes confocal IR laser scanning microscopy for measuring post-bond parameters of 3-D stacked integrated circuits. Is a nondestructive, through-silicon metrology technique that monitors a variety of post-bond parameters, including overlay alignment accuracy, bonding interface thickness variations, and bonding interface quality including pre- and post-bond defect inspection and review. Measures alignment points at selected die of bonded wafers, stores images and data, and summarizes results. Correlation of overlay alignment offset data to electrical yield provide an early indication of bonded wafer yield. Software tools display data in the form of vector maps. Confocal capability permits thin optical sectioning in Z and construction of 3-D images of the bonded wafer interface and structures. 3-D reconstructions can be used to create sections in the XZ plane. Bonded wafers are automatically scanned at low magnification. Images are stitched together to form a single wafer image. When the overlay vector map is superimposed on the scanned wafer image, correlation of many of the failed overlay measurement points to bonded interface anomalies can be seen. Stitched image can be viewed and zoomed. Any site can be revisited and the image reviewed or rescanned and imaged using the IR microscope with objective magnifications up to 90x and 0.14µm pixel resolution.

Olympus Integrated Technologies, www.olympus-ita.com