Single and double row solder cup spring pin header strips are for wire termination in test and field applications where stackup tolerances or blind-mating can be a challenge. Each spring pin provides 0.0275" of mid-stroke compression (0.055" max. compression) and is rated for one million cycles. Solder cup is sized to accommodate up to a 22 AWG wire; has gold-plated brass components and beryllium copper springs. 824 and 826 series headers feature spring-loaded pins rated at 3A max. (2A continuous use), high-temperature Nylon 46 insulators; come in 2-64 positions single row and 4-64 double row.
Mill-max, www.mill-max.com/PR618
Renew eco-stencil AQ batch stencil cleaner is designed for ultrasonic and spray-in-air systems. Removes all types of solder paste (e.g. water-based, RMA, no-clean, Pb-free) and uncured adhesives from stencils and misprinted boards. Is a drop-in replacement for semiaqueous and aqueous cleaners. Compatible with frame, screen, stencil and adhesives. Is compliant with CARB (California Air Resource Board), REACH and WEEE.
Techspray, www.techspray.com
Stand-up tip caps seal syringe barrel tips during storage and shipment. Have large, flat bottom surfaces that enable syringe barrel to stand upright. Existing entrapped air migrates to piston, to ease removal. Are molded from polypropylene resin; compatible with a range of dispensing fluids. Feature large knurled gripping surfaces for simple installation and removal. Come in packs of 50 and bulk packages of 1000.
Techcon Systems, www.techconsystems.com
ME-555 underfill encapsulant was developed for semiconductor packaging and assembly. Is comparable with underfills such as Henkel 4256; offers excellent flow characteristics, thermal cycling reliability and low coefficient of thermal expansion. Is a high purity, semiconductor-grade epoxy underfill material for the encapsulation of flip chip devices. Reduces warpage; handles over-molding processes. Can be used under CSP/BGAs and small dies with standoff heights as small as 25µm. Provides good adhesion to laminate, ceramic, solder mask and metal surfaces, as well as high Tg and high fracture toughness.
Lord Corp., www.lord.com
SI-F1000 series micro-head spectral-interference laser displacement sensor is designed to provide high-precision performance in a 2mm diameter sensor head. Is a low power optical system using fiber-optic detecting; measurements can be taken without electromagnetic effects or additional head to measurement system. External signal processing is eliminated. Controller models include built-in digital and analog data outputs. Includes onboard data storage and calculation functions. Applications include wafer thickness and warpage mapping; media thickness and surface characterization, and inline thickness measurement of transparent webs and coatings.
Keyence, www.keyence.com/PRSI
TMV (through mold via) 14mm board drop test Pb-free kit is designed for Amkor TMV component. Eight-layer test board is a 3x5 array with 15 component placements per board. Is 132 x 77mm and 1mm thick. Standard surface finish is OSP. Is designed for TMV 620 solder ball 0.4mm pitch bottom component and TMV 200 solder ball 0.5mm top component. Both have a daisy chain pattern through the substrate of the part; daisy chain pattern also runs through the test board.
Practical Components, www.practicalcomponents.com
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.