Resin Remover Solvent and Conformal Coating Remover Gel have been developed to work without the use of dichloromethane; has been replaced with a safer alternative solvent blend. RRS is designed to swell and soften, and dissolve cured coatings, as well as epoxy and polyurethane resins. CCRG thixotropic gel is formulated to remove solvent-resistant coatings (including DCA, DCB and DCR). Both will be available in November.
Electrolube, www.electrolube.com
DB-1541-LTC low-temperature curing conductive adhesive is for use in organic solar modules or other temperature-sensitive photovoltaic devices. Optimized for excellent conductivity and stability on various substrates when cured at 100°C. Has a dispensing work life greater than 48 hrs. (measured as a 25% increase in viscosity), while maintaining optimized rheology for dispensing and excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. Is reportedly ideal for flexible photovoltaic applications with high peel strength. Can be fast cured at elevated temperatures (1 min. at 180°C).
Engineered Conductive Materials, www.conductives.com
Single coated engineered tapes are designed to solve static dissipative, halogen-free flame-retardant and high-temperature applications. Are REACH and RoHS compliant and available in a variety of polyimide, polyester and aluminum constructions. Include an array of liners for hand or die-cutting.
Polyonics, www.polyonics.com
Aquanox A4638 is an electronics assembly and advanced packaging cleaning agent. Is designed to remove flux residue from flip chip and low clearance components; removes water-soluble polar flux residues at low concentrations. Is a nonhazardous, biodegradable aqueous solution. Contains no CFCs or HAPs; is RoHS-compliant, and Halogen-, Halide- and Hexane-free. Is compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes.
Kyzen, www.kyzen.com
Flight Status Board Tracking System tracks the progress of circuit boards throughout the manufacturing process. Can see defects in real-time. Is visible for employees to track the status of orders at any point in the manufacturing process. Touch-screen displays present a list of projects and board counts within specific process centers, including the quantity of boards in previous and subsequent process centers. Can see enforced route and contact information of specific project. Can see when nearing the end of the quantity of boards for current run.
ACD, www.ACDUSA.com
The free, illustrated 2011-2012 Dummy Component Catalog is now available. Features dummy components that have the same materials and are made on the same production lines as live components, as well as standards and future technology needed. New sections in the catalog include an expanded selection of flip chips and flip chip test kits; Quick-Pak open-molded quad flat pack no leads; FusionQuad board and kits; IPC A620 compliant wire harness kit; IPC PCB-J-STD compliant hand solder kit; PCB-B-25A standard test board; PCB-B-24 standard test board, and PCB-B-36 standard test assembly. Numerous product revisions also are included. Additional technology includes Amkor’s TMV package; WLP Wafer Chip Size Packages’ finished package, and a Dummy Component Sample Case.
Practical Components, http://www.practicalcomponents.com/catalog.htm
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.