iFlex SMT solution is designed to increase productivity in high product mix environments by more than 30%. Uses single‐pick/single‐place technology; reportedly has defect levels of less than 10 DPM. Features dual transport lanes, dual-sided feeding, internal buffer positions, and feeder and trolley exchanges during production. Is designed for high throughput. Uses ‘Independent Dual Lane’ concept to provide volume on one lane, while frequently changing jobs on the second. Can be configured to tailor assembly lines from one to more than eight modules. iFlex T4 suits chip and small IC shooting (4 placement robots, placement speed of 51,000 cph, 128 twin tape feeder positions); iFlex T2 is aimed at flexible placements (2 placement robots, placement speeds of 24,000 cph, 128 twin tape feeder positions); iFlex H1 is for ICs and fine pitch placements (1 placement robot, placement speed of 7,100 cph, max 146 twin tape feeder positions/max 30 tray positions).

Assembléon, www.assembleon.com

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