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BluePrint-PCB v. 3 for PCB documentation now features enhancements to the panel drawing feature and dimensioning and assembly reference designator functions. Upgrades include flip panel support; flipped images supported in panel setup; flipped image updates support mapped layer display; auto calculation settings for panel matrix maintained in spreadsheet mode for panel setup; panel corner chamfering now defined in the panel setup; web route display merging now removes score line display for score lines that intersect web routes; web route display removes web route display for web routes that cross inside board outlines, and snapping to mill tabs is updated for mill tab placement, dimensioning to mill tabs and mill tab alignment. Performance updates made for designs with complex board outlines; scaling support added for panel drawing setup; can specify for panel, PCB or both; exploded view pictorial display can be placed onto a separate sheet from the source PCB view; outline for an exploded view can be defined as a closed polyline, and when component outlines overlap, the associated reference designators are placed inside owning component outlines without reference designator overlap. New controls are available to specify display order for data types within a PCB View; callout bases and coordinate dimensioning text can now be aligned. Reference designators can be found that overlap component outlines or other reference designators. Tooling holes can be found that have been added, deleted, or modified on re-import of CAD data. Edges of the board outline can be found that have modified on re-import of CAD data. Dimensions not tied to a PCB view or shape can be found. Customization to BluePrint-PCB menus and toolbars can now be saved to an external file and restored to new BluePrint-PCB installations. Mentor Boardstation ODB++ import interface extended to support polarity markings defined in the CAD database. Two BluePrint release packages can be merged into one release package. More than 50 customer defects and enhancements resolved.

DownStream Technologies, www.downstreamtech.com

Opus Selective Solder Risers are offered as replacements to the OEM model. Built with superior steel alloys and precision machining said to be more durable and longer-lasting than OEM originals while maintaining all original Gaussian design properties. The unique nozzle design increases solder wave height and precision, improving the ability to solder in tight spaces and around nearby components. Guaranteed to function properly with original equipment.

Count On Tools, www.cotinc.com

 

Register now for Virtual PCB, the industry's only live, fully interactive, Web-based conference and trade show for PCB engineers, designers, fabricators, assemblers and managers worldwide, March 8-9. www.virtual-pcb.com

 

NC258 no-clean solder paste is designed to offer a long pause-to-print window, while enhancing fine print definitions. Reduces voiding and head-in-pillow. Wetting ability results in bright, smooth and shiny solder joints. Offers very low post-process residues, which remain crystal clear after soldering. Is halogen-free and halide-free.  Is best used within nine months when stored at 4°C – 12°C, or four months at room temperature. Is available in a variety of packaging.  

AIM, www.aimsolder.com

JX-200LED features new algorithms created for the placement of side- and top-view LEDs, rectangular ferrite chip-type and PLCC-type LEDs. Is a placement solution for LED chips in laptop computers, LCD backlights and various lighting equipment. Features an upward looking camera for QFP/QFN lead inspection and BGA ball inspection, as well as 1200 mm board capability with multi-indexing. Designed to support a 31.5" x 14" board size when indexed twice in the machine, and a 47.2" board when indexed three times.  Components are rotated 360° in the laser. Supports an automatic tool changer. Can place 15,300 chips per hr. at IPC 9850; supports placement of parts from 01005 to 33.5 mm2. Features an optional tri-colored vision centering system for placing fine-pitch QFPs, BGAs and QFNs.

Juki Corp., www.jukiamericas.com

CO2 laser marking systems are for marking printed circuit board material and glass, thin film plastics, and organic material. Can mark high-quality text and barcodes directly on FR-4 material, labels or screen-printed areas. Moving parts can be marked inline using “mark on the fly” option. Come in a variety of standard and custom enclosures. Can be tailored to particular application and mark requirements, and feature barcode scan program select, vision corrected marking, motion control  and barcode verification. System configurations offer options for loading/unloading and process flow. 

Miyachi Unitek, www.miyachiunitek.com

The 180 x 50 cm automatic, inline printing system is for LED tubular lamps that will replace fluorescent lamps. The line consists of a large-format printing system, multiple pick-and-place machines, and a curing or reflow system. Can produce all lengths of LED tube lamps up to 180 cm. Inline screen/stencil printer permits a panel for multiple 180 cm tubes to be printed in one run. Automatically loads and prints PCBs and forwards them to the pick-and-place system. Conveyor system is designed to transport heavy aluminium-based PCBs commonly used for LED products. One or more pick-and-place machines are installed inline to mount LEDs and other electronic components onto the PCB. MIS software automatically balances the work load over multiple machines. A high-performance reflow or curing system is installed inline. Line can be customized.

Essemtec, www.essemled.com

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