Circuits Assembly Online Magazine - Features

Juki SMT tooling nozzles include 500 and 800 series nozzles in both base designs (gold/silver). Enable accurate chip placement. Are available in standard nozzles (Type 500-508) and custom designs (Type 510-558; 800-803 Grippers). Special nozzle designs for odd-form components, such as LEDs, switches, and connectors. Guaranteed to function properly with KE2010, KE2020, KE2030, KE2040 (gold nozzles), KE2050, KE2060, KE2070, KE2080, KE3020, KE1070, KE1080, FX-1, FX-2, FX-3, JX-100 and JX-100LED (silver nozzles).

Count On Tools Inc., www.cotinc.com

Process Monitor statistical process control software enables production management. Includes comprehensive statistical process control charts that measure process capability. Built-in, real-time monitoring tools enable SPC capabilities on the inspection system in existing production lines. Preconfigured functions permit quick access to information. Enables in-depth data analysis to identify trends and enhance line yields. Is designed for quick installation and easy operation.

CyberOptics, www.cyberoptics.com

Model 4800 is part of the 8th Generation automated device programmer line. Programs up to 36 devices in parallel at a rate of up to 1,500 devices per hr. Offers universal device support, capable of programming microcontrollers, NAND flash, NOR flash, Serial flash, Managed NAND flash, E/EPROM, flash EPROM and other technologies with densities up to an 8 Eb theoretical limit. Supports devices with voltage down to 0.7 (Vdd). Includes Vector Engine Co-Processor; accelerates waveforms during programming cycle. Has LaserAlign sensor. Is ideal for high-volume production; can use 1 to 36 socket cards and is compatible with Flashstream socket cards.

BPM Microsystems, www.bpmmicro.com

BR720 Pb-free rework station desolders, removes and replaces BGAs, QFPs and other fine-pitch devices. Uses split-vision zoom optics with 22x magnification. Real-time images of components superimposed on solder pads are continuously displayed on monitor. Make final X and Y micrometer adjustments with LED lighting providing high-image contrast for alignment. Controlled heat, from hot air top and bottom, is capable of Pb-free temperatures up to 350ºC. IR underheater said to prevent board warpage. Uses onboard independent K-type thermocouple port. Placement head with automatic Z axis removes, places and solders components without intervention. Includes a built-in vacuum generator. Accommodates boards to 550 x 500 mm.

Manncorp, www.manncorp.com

Pantera-XV SMD placement machine is designed for prototype and mid-size series manufacturing. Meets standards of a high-mix/low-volume production. Application range is large. Is capable of placing 4,500 components per hr. Features optical laser and vision centering. Can place all SMD components from 0201 up to 50 mm x 50 mm. Has large feeder capacity and automatic identification of intelligent feeders. All tape feeders are electrically driven. Feeding pitch is programmable.

Essemtec, www.essemtec.com

iineo-II dual-head VLB is designed for the LED assembly segment. Can process PCBs that exceed 48" in length at speeds often exceeding 20,000 CPH. Optimizes productivity in high-mix environments. Can accommodate PCBs as large as 24" x 63". Is ideally suited for handling LED PCB form factors, particularly industrial fluorescent lighting. Can be converted from single-stage handling to four-stage handling of large, typical sized PCBs (up to 18" x 20"). Is backwards compatible with all iineo-II machines. Offers a heavy PCB option for higher mass conveying up to 22 lb. Automatic conveyor offers full-edge clamping, fiducial correction and features a SMEMA interface.

Europlacer, www.europlacer.com