Circuits Assembly Online Magazine - Features

F9000 PCB holding and transport racks are customizable. Basic unit holds 32 boards up to 6.7" long. Modules can be assembled side by side to hold longer printed circuit cards. Standard extrusions permit card width up to 10.25", with custom extrusions available. Pop in molding strips for the back of the side plate can be used as PCB stops. Card guides are tapered at the front end for easy PCB insertion. Runner spacing is 0.39" with a depth of 0.079". Capacity: 30 PCBs 6.7" long. Made of conductive plastic, temperature-rated to 176°F with a surface resistance <106. Used for in-process work or placed into containers for horizontal storage.

FKN Systek, www.fknsystek.com

PS900 soldering system for PV tabbing and bussing applications has STV-DRH40 hoof tip geometry said to optimize the power delivered to the solder joint, and a temperature-sensitive heater to minimize thermally induced stresses on cell surfaces. Incorporates SmartHeat technology said to produce and maintain a specific, self-regulated temperature with a heater that requires no calibration and responds directly to thermal loads. Works with two solder alloys for solar cell soldering.

OK International, www.okinternational.com

Expert semiautomatic SMT pick-and--place system is for small batches and prototypes. Comes with MPL3100 integrated vision and placement system, with double prisma optical system. Compatible with reels, sticks, tape and trays. Can come as complete prototyping station, including a dispenser and reflow tool.

Essemtec, www.essemtec.com

Servo-Flo 704-PGM two-component, variable-ratio, high-volume meter-mix dispenser can move the system in pieces through small openings or store the system in a small, confined area. Is designed to dispense materials at various fluid ratios and flow rates, without making mechanical changes. Adjustments to ratio or material flow are made electronically. Is a continuous flow dual-gear system that mixes and dispenses two-part polyurethanes, epoxies, silicones and acrylics. Provides fixed and variable flow-rate dispensing or variable flow-rate profiling. Three levels of operator interface controls are available. Selects a preset dispense program of fluid volume settings and output flow rates for different-size part batches or extruded bead sizes; accepts inputs from an automation controller. Accepts low- to high-viscosity materials.

Sealant Equipment & Engineering Inc., www.sealantequipment.com

OvenRIDER SPC V5.23a and WaveRIDER SPC V5.23a are now compatible with Microsoft Windows 7, Vista and XP operating systems. Configured by the user, the Data Table displays the most important thermal profile parameters for the process.

For OvenRIDER, values are graphically illustrated on the Data Graph showing how and where they are extracted from the profile.

WaveRIDER now includes the ability to import .MDM files, along with the associated part and process information.

ECD, http://www.ecd.com/downloads/download.asp?action=form&file=ORSetup

Q2170 fine-pitch, fine-wire (17 - 75 µm), automatic Al/Au automatic wedge bonder is for smaller lot sizes, multiple product variations and frequent setup changes. Supports prototyping to medium-volume production. Designed for packaging complex hybrid, CoB/PCB and LED display devices; achieves wedge bonding for fine gold, aluminum wire and ribbon, and is said to enable quick package conversions. Operator interface provides point-and-click bonding; unlimited wires; easy bond process editing; extensive program storage, and a bond parameter library. Options include programmable ultrasonic generator (256 increments) with low impedance transducers, programmable temperature controllers (optional dual-loop), application-specific software, and custom machines with a table up to 200 x 300 mm.

Questar Products International, www.questarproducts.com