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The 5.0/7.5/10.0 mm triple-span radial machine has large span capacity that reportedly virtually eliminates manual assembly requirements. Features 10 mm tooling for the Radial 8XT. Comes in standalone and pass-through configurations. 15 mm dispense head tooling is offered.

Universal Instruments, www.uic.com 

 

Tridak Model 785 poppet valve dispenses low-to-medium viscosity materials, such as adhesives, silicones, greases, and other filled materials. Design minimizes friction between the actuating components of the valve and the material being dispensed. The stroke adjustment and control feature offers precise adjustment of fluid deposit volume and flow. Material is shut off cleanly at the end of each cycle. Peak performance is obtained when actuated with Tridak Model 345 valve controller.

Tridak, www.tridak.com

 

Circuit frames for PCB repair can be custom laser-engraved to match the pads or trace areas requiring repair. Patterns on the frames can accommodate spaces/traces down to 0.025 mm. Designed for SnPb and Pb-free processes. Cutouts replace pads or traces on 1 oz copper PCBs. Come in epoxy and dry-film versions. Custom patterns can be laser-machined with lot sizes as low as one.
 
BEST Inc., www.solder.net

 

MicroLine 1000 E UV laser system is for separating thin or flexible assembled and unassembled panels. Is noncontact and reportedly does not affect conductors or components near the cutting channel. System software imports data directly from popular layout programs. Handles boards up to 229 x 305 mm (9” x 12”). Integrated vacuum table holds boards securely in position, with no need for further clamping devices; an advantage over conventional laser separation techniques for thin and flexible substrates.

LPKF, www.lpkf.com

MicroLine 1000 E UV laser system is for separating thin or flexible assembled and unassembled panels. Is noncontact and reportedly does not affect conductors or components near the cutting channel. System software imports data directly from popular layout programs. Handles boards up to 229 x 305 mm (9” x 12”). Integrated vacuum table holds boards securely in position, with no need for further clamping devices; an advantage over conventional laser separation techniques for thin and flexible substrates.

LPKF, www.lpkf.com

S3088-III AOI features enlarged inspectable PCB dimensions and improved camera technology. Is for economical electronics assembly inspection, from prototype to large series. Can be deployed for paste print or placement inspection. In high-resolution mode, reportedly detects defects on 01005 components. Revised PCB transport permits boards up to 20" x 20" to be inspected. Can be equipped for extreme cycle time requirements or heavier PCBs. Offers color evaluation for angled inspections. Comes with switchable resolution with the OnDemandHR function or integrated verification.
 
Viscom, www.viscom.com

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