BlissLift (BL600) has a more robust column, larger lift platform and increased load capacity. Features the same adjustable width legs and push bar as standard BlissLift. Is capable of lifting more than 600 lbs at a 24" load center.  Lift platform can pick up 19" rackmount chassis. Works with standard Bliss Chassis Cart.

Bliss Industries, www.blissindustries.com

CHO-SEAL 6502 and 6503 EMI gasket materials were developed for high-performance in adverse environments common to aerospace, automotive and telecommunication applications. Are Ni-plated aluminum particle-filled silicone and fluorosilicone elastomers. Offer shielding after exposure to high and low humidity and temperature cycles, as well as salt/fog environments. Come in molded and extruded product forms, as well as a silicone, thermally cured, robotically dispensed and a form-in-place version: CHO-FORM 5560. Filler technology performs when used against aluminum flanges with either MIL-C-5541 trivalent or hexavalent, Class 1A or Class 3 chromate conversion treatment. NiAl particles reduce aluminum flange galvanic corrosion activity by factor of two.

Chomerics, www.chomerics.com

MicroLine 1000 S depaneler features a UV laser beam for cutting along components or circuit paths, reportedly without mechanical or thermal interference. Is toolless, allowing any contour. Is programmable via included software or via the CAD software. Compact footprint.

LPKF, www.lpkf.de

 

Stamped Circuit Board thermal management draws heat away from beneath the chip quickly. Combines structured layers of metal and plastic for use in substrate assemblies. Is based on a reel-to-reel concept and offers possibilities to automate production. Possible solutions: with versatile stamping, materials can be inflected and stamped; the resulting shape stabilizes the substrate and fixates the lenses; open choice of many different materials and thicknesses; simpler operation, and quicker separation.

Heraeus, www.wc-heraeus.de