Bowman A Series Micro XRF measures smallest features on semiconductors and microelectronics.
NC-809 halogen-free, ultra-low residue, flip-chip flux is designed to hold die or solder spheres in place without risk of die shift during assembly.
EP2 tantalum capacitor is available with radial through-hole terminations with stud-mount option in B and C case codes.
High Speed Alignment software reportedly can increase speed of six-axis robots 70% and improve accuracy 50%.
