Bowman A Series Micro XRF measures smallest features on semiconductors and microelectronics.

NC-809 halogen-free, ultra-low residue, flip-chip flux is designed to hold die or solder spheres in place without risk of die shift during assembly.

KW30 1mm-pitch wire-to-board connector is available in two to eight positions.

EP2 tantalum capacitor is available with radial through-hole terminations with stud-mount option in B and C case codes.