Siplace SiCluster Professional software determines component overlaps in family setups. Groups shared components on constant component tables, which remain on the machine during setup changeovers. Reportedly reduce setup time by hours, while reducing space and investment requirements for feeders and component carts by up to 33%. Is available as an add-on to Siplace Pro v. 7.1, which offers setups for single products or product families combined with fixed setups, offline setups of feeder tables and changeover tables concepts, nonstop setup changeovers with line execution system, or random setups of individual feeder modules.
Siemens Electronics Assembly Systems, www.siplace.com
Wets to a range of surface finishes, and can be used in environments from 30°C at 84% RH. Features open and abandon times of two to three hours, standard refrigeration storage, six-month shelf life and good hot slump resistance.
Henkel, www.henkel.com/electronics
Dual Lane Reflow Oven provides high- and low-volume SMT soldering in one reflow unit. Features flexible production in parallel and is compatible for both Pb-free and leaded SMT. Reportedly reduces floor space 47% compared to traditional dual-lane production lines. Contains two independent conveyor lanes and two heating areas. Has 18 independently programmable heating zones, with both top and bottom side heating areas. Conveyor speeds and widths are independently controlled and adjustable.
SEHO Systems GmbH, www.sehona.com
GoWave 1030 wave soldering system is for low-volume production for both leaded and Pb-free applications. Is for soldering small- or medium-sizes batches. Now features a longer reflection tunnel over both the preheat area and the solder pot. Has been redesigned as one unit. Features a new spray flux nozzle with HVLP technology. Has a PCS 707 touchscreen controller and USB interface. Service points for the fluxer and compressed air are now located directly at the inlet section of the machine. Features a new switch cabinet and updated pump motor, as well as a redesigned exhaust area and conveyor.
Seho Systems, www.sehona.com
S3X58-M650 solder paste is an ICT testable, halogen-free SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.
S3X70-M407 Pb-free no-clean solder paste for ultra-fine-pitch applications uses a Type 5 powder; has been formulated for 0.2 mm pitch (µBGA) devices and 01005 components. Is said to wet in air environments and is low voiding.
Koki Co. Ltd., www.ko-ki.co.jp
Marantz, www.escapethegrayworld.com
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