Multicore HF108 is a Pb-free, halogen-free solder paste. Has high-speed print capability, a shelf life of up to six months when refrigerated or four weeks at room temperature, and a wide process window.
Henkel, www.henkel.com/electronics
BM10 series FPC-to-board connectors are RoHS-compliant and halogen-free. Are available with stacking heights of 0.6 and 0.8 mm; feature 2.98 mm depth and 0.4 mm contact pitch. For use in printers, industrial controls, medical and instrumentation equipment, and multimedia devices. The 40-position connectors feature enhanced self-alignment mechanism via guidance ribs, with a self-alignment range of 0.3 mm. Have metal fittings and a clipping contact design.
Hirose Electric Co. Ltd., www.hiroseusa.com
MCP screen printer has a head design with variable attack angle printing that reportedly permits constant solder pressure independent of stencil thickness. Single-head system reportedly reduces maintenance by half. Board cycle time is as low as 11 sec. Reduces defect per million figures by up to 50%. Has a flat-metal single-head squeegee. Variable angle print head improves repeatability of paste deposition for 01005 components. Produces solder shapes with stencil thickness down to 50 µm, and half-edging stencils with stencil steps of 30 to 50 µm. Is ideal for PCBs mixing 01005 (0.4 mm x 0.2 mm) types with larger component sizes.
Assembléon, www.assembleon.com
Electrolube, www.electrolube.com
GTO graphical user interface helps rework and assembly technicians locate single or multiple components on a PCB. Produces a unified PCB image by combining top and bottom Gerber silkscreens, pick-and-place drill files, and formatted BoM (.csv file). Creates a composite view of PCB by fusing silkscreens, parts list, and placement information into a single view, allowing locating an individual component or a group of BoM line-item components. Generates assembly notes, and automatically generates symbol/color coded assembly prints, showing exactly which parts need to be located in certain locations on the PCB. Stored project bundle creates a single file containing top and bottom silkscreen, pick-and-place, BoM, and notes to be distributed to engineering or customers.
Saelig Co., www.saelig.com
XT V 130 x-ray inspection system is compact and comes with a 30-130 kV open micro-focus x-ray source, 4-axis programmable manipulator and 16-bit imaging system based on a 4” image intensifier. Reports compliant with MRP systems. Focal spot size down to 3 microns, 320X geometric magnification and tilt angle up to 60°. Rotate stage and CT capability optional. Hinged door provides access to inspection area, which fits samples up to 40 x 35 cm (16 x 14”).
Nikon Metrology, www.nikonmetrology.com
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