Circuits Assembly Online Magazine - Features

Hysol UF3800 is said to provide room temperature fast flow, low temperature cure and reworkability. Is for use with CSPs and BGAs; is suited for handheld communication and entertainment applications. Is halogen-free, with less than 900 ppm chlorine and bromine. Is compatible with a variety of Pb-free and halogen-free solder pastes. Offers a high glass transition temperature. Reportedly offers stable electrical performance under temperature humidity bias.

Henkel, www.henkel.com/electronics

Cobar MCI-2330 is a stencil-cleaning agent for removal of solder paste and adhesive residues from all types of stencils. For used in immersion and ultrasonic cleaning equipment for removal of paste or flux residues on stencils and assemblies. Is nonhazardous and has a low odor.

Balver Zinn Group, www.balverzinn.com

Cobar Europe, www.cobar.com

Model 455 dispensing valve is a pneumatically operated, two-way pinch valve. Features micrometer control over flow rate. Has an over-stroke adjustment, positive shutoff and disposable inert wetted parts. Can be used as a dispense valve or as an inline valve with adjustable flow. Teflon tubing is recommended, but can use materials such as silicone, urethane, polyethylene, or vinyl tubing. Easily integrates into automated assembly lines and can be fitted with a number of different style dispense tips and spray nozzles. Dispenses low-to-medium viscosity materials, including adhesives, UV resins, flux, gels, solvents and more.

Tridak LLC, www.tridak.com

Araldite EP1000 A/B epoxy adhesive is a two-part, thixotropic paste with a convenient 2:1 mix ratio and low viscosity that accommodates handling. Comes in dual-barrel cartridge mixing kits for waste-free application. Cures at temperatures ranging from ambient to 212ºF. Achieves a stable maximum Tg after gelling at room temperature, followed by a mild heat cure. Requires no autoclave cycling. Reportedly has high lap shear strength and good peel strength.

Huntsman Advanced Materials, www.huntsman.com/advancedmaterials

WS177 lead-free water-soluble solder paste is said to meet standards for solder spread and wetting and meet IPC-7095 Class III resistance to voiding under straight ramp or soak reflow profiles. Is reportedly fully cleanable after two paste reflow cycles, with a wide cleaning process window. Is compatible with SN100C and SN97C alloys with Type 3,4 and 5 solder meshes. Can be used with OSP, ENIG, immersion silver, and immersion tin finishes.

FCT Assembly, www.fctassembly.com

Duralco 122 nickel-filled adhesive and casting epoxy is formulated to provide an alternative to silver-filled, electrically conductive epoxies for applications up to 500ºF. Is said to be ideal for manufacturing and repairing flexible circuits, solder replacement, bonding semiconductors, EMI shielding, thermistors, wire tacking, heating elements, assembling and electronics. Is two-part epoxy mixed by hand. Cures at room temperature in 16-24 hr. at 75ºF, or can be fast-cured in 10 min. at 200ºF. For optimum conductivity, adhesion and strength, post cure at 250º for 2 hr. Is said to be resistant to moisture, chemicals and solvents.

Cotronics Corp., www.cotronics.com