The Paste Roll Height Monitor is a productivity tool designed to eliminate defects. Uses lasers to detect solder paste; monitors height of the paste roll. Uses Instinctiv V9 for setup. Consists of two sensors that sit on either side of the squeegee blade framework support and are fully integrated into most printer software. A light curtain detects solder paste presence or absence, sending a signal to the printer. If paste crosses the light threshold and breaks the light beam, the printer reads that as a signal that paste is present and will continue to process boards as normal. If the light curtain is not disturbed, indicating a low paste height, the printer will alert the operator to add solder paste. As the paste roll starts to recede, the printer issues a warning.

DEK, www.dek.com

MRS-1000 Modular Rework System is a convection rework system for removal and placement of BGA/CSP and SMT components. Is comprised of a handheld convection tool with an array of nozzles, preheater, adjustable tool holder with board holder, and light magnifier. Capable of handling PCBs up to 12" x 12" or above using standalone BH-1000 board holder; is equipped to process components up to 40 x 40 mm. Features include programmability, a digital display, program storage of up to 50 profiles and adjustability. Features HCT-1000 programmable handheld convection tool, digital controls, internal or external thermocouple feedback control, profile storage and integrated vacuum pickup. HN series nozzles fit applications reworking components of all sizes, including BGAs, QFPs, LGAs, PLCC and SOIC. Features PCT-1000 programmable preheater.

OK International, www.okinternational.com

QX Hawk barcode imager is integrated with liquid lens technology. Reads any barcode or 2-D symbol, including 2-D direct part marks, within seconds. Is reportedly the first high-performance imager to have the flexibility to read any mark at any distance and speed in any environment, and the first to fully integrate liquid lens technology. Uses decoding technology to read marks at distances from 50 to 500 mm and beyond, from a high-density data matrix to a large linear code to a low-contrast DPM. Features a high-resolution modular optical zoom system. Includes visible LED indicators and an EZ button for instant setup and configuration. Leverages a dual-core ARM/DSP processor and integrated Ethernet protocols.

Microscan, www.microscan.com

CN-1728 reworkable underfill encapsulant is designed to underfill package-on-package assemblies. Reportedly has a lower coefficient of thermal expansion, higher Tg, and better compatibility with flux residues. Is a fast-flowing capillary underfill with a viscosity of 900 cps; can be cured in as little as 1 min. at 150°C. Is suited for high-volume, high-speed inline processing. Rework is accomplished by use of temperatures between 170°C and 180°C to remove the underfill fillet. Then, the BGA is lifted from the board after heating it to reflow temperature. Underfill residue is easily scraped off.

Zymet Inc. www.zymet.com