The Integrated Process and Stencil Support (iPASS) system targets defect reduction and Lean manufacturing principles. Is said to provide upfront design for manufacturability support; offers a spectrum of stencil technology and related tooling; provides comprehensive process management. Duplicates stencils and processes from one line to the next, and throughout global manufacturing network. Includes stencils, screens, blades and related tooling. Provides CAD services, including design review and check plots, design library standardization and management, and weekly reporting. Includes training, managed product rollout, order confirmation and on-time delivery, and data reporting.
 
Photo Stencil, www.photostencil.com

 

Universal Cover Tape 2688, Static Dissipative contains an antistatic coating designed to help prevent product damage and loss resulting from static charge causing components to stick to the cover tape. Also available is Universal Cover Tape 2680, Non-Conductive, for products not susceptible to static charge. Designed to seal electrical and electronics components into embossed carrier tape materials, including paper. Are said to be compatible with virtually all equipment and carrier tapes. Have pressure-sensitive adhesive, designed to create a strong bond to polycarbonate, polystyrene and paper carriers. Help reduce risk of component migration, flipping, vibration and chip sticking in feeders.

3M Electronic Solutions Division, www.3M.com/electronics

 

Gensonic manually operated ultrasonic generator comes with a single 40 kHz transducer unit, for cleaning solder paste stencils. An additional transducer head can be employed for tougher applications. Cleans paste left in stencil apertures.

GEN3 Systems, gen3systems.com

Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has RS-232C interface with SPI and NG PCB anti-touch verification. Is said to provide increased line efficiency and requires minimal space. No need to filter NG PCBs, and SPI operates normally, even during NG PCB verification. AOI NG Buffer stacks NG PCBs and pushes good PCBs to the next AOI inspection process. Features a PCB shock-free and noncontact power transmission. Both systems feature a SMEMA interface, a slim, round design, adjustable stacking, a LED tower light and touch-screen operation.
 
Young Jin/Seika Machinery Inc., www.seikausa.com