Universal holder and blade assemblies are available to fit the following SMT printing equipment: Yamaha, Tenryu-Sieki, Hitachi, Milara, Speed-Print, Samsung, Misuzu and Minami. Feature lightweight design, sliding paste retainers, and flat, secure screw locking of blade. Options include colors (-red, -blue, -green or -silver) and squeegee angle.
Transition Automation Inc., www.transitionautomation.com
Zebra Gold 8000 Series elastomeric connectors reportedly provide excellent board-to-component electrical contact for broad-ranging commercial and military applications. Deliver current carrying capacity of 250-500 mA amps per wire; exhibit electrical resistance of 25-50 milliohms. Are constructed from a low durometer silicone core covered with parallel rows of flat, gold-plated conductors ranging from 100 to 166 wires per inch. Pad spacing as close as 0.020" centers.
Fujipoly America Corporation, www.fujipoly.com
Therm-A-Gap T652 thermally conductive dispensable gap filler is a fully cured, single-component material suitable for filling variable gaps between multiple components and a common heatsink. Has a high thermal conductivity of 3W/m-k and an operating temperature range of -50ºC to +150ºC. Applications include automotive ECUs, electrical drives, light-emitting-diode modules and power semiconductors. Is conformable at low assembly pressures and is said to be suitable for providing a filler for gaps between 0.2 mm and 4 mm. Is RoHS-compliant and has a shelf life of 18 months. Can be applied manually using a syringe or via automated processes. Package sizes range from 10 cc syringes to 5 kg pails.
Chomerics, www.chomerics.com
Alpha CVP-360 Pb-free, no-clean solder paste is formulated with low-Ag SACX 0807 and 0307 alloys. Reportedly delivers excellent printing characteristics, permitting the use of Type-3 solder powder, even when 300 µm features are being printed using a 125 µm stencil. Permits high-speed printing; reduced stencil-cleaning frequency. Has a wide reflow process window.
Cookson Electronics Assembly Materials, www.cooksonelectronics.com
The ESD Pro Event Detector and the Ground Pro Ground Integrity Meter are designed to protect sensitive electronics components and help prevent equipment malfunction by detecting ESD, EMI and measuring ground impedance. The latter helps diagnose and troubleshoot ESD issues, evaluate ESD-protective equipment and qualify tools. Measures the effectiveness of ESD safeguards. Detects and counts discharges, and monitors the relative strength of each ESD event. Audio alarm alerts to an event while an LED bar graph displays the event strength. Rejects most non-ESD related electromagnetic interference events. Ground Pro measures ground impedance to the milliohms and verifies grounding parameters in accordance with ANSI 6.1 and ANSI/ESDA S.20.20 standards. Is said to provide accurate measurements of ground impedance on a working tool when ground noise is present. Measures AC and DC voltage on the ground while separately measuring EMI. Both are handheld.
3M Electronic Solutions Division, www.3mstatic.com
Xtent Technology Rules Editor is offered in version 4.0 Mozaix and 6.0 Pantheon. Provides rules management and high-speed constraint options in data flow passed to and from the Mozaix schematic and Pantheon layout. User interface is said to permit quick creation, manipulation and assignment of design rules and constraints in an integrated application. Spreadsheet format includes visual previews for layer stackup and padstack construction and color-coded highlights to indicate rule or constraint violations and changes in layer rules. Design flow includes the ability to define signal path lengths, net lengths or pin-to-pin length constraints using formulas and functions, as well as the ability to auto-define signal path objects through user-specified pattern criteria. Length values can be formulated through a signal path class, or directly to one or more signal paths at a time. High-speed-specific, RF-specific and hybrid-specific design flows are available in standard applications.
Intercept Technology Inc., www.intercept.com
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