The FH family of flexible circuit connectors come in different configurations with contact pitches ranging from 0.3 to 1 mm. Are for flexible printed circuit and flat flex cable-type connections. Certain models feature side-retention tabs. Includes: 

FH12 – ZIF connector; 0.5 mm and 1 mm pitch; top or bottom contact points; horizontal and vertical mounting; front flip lock actuator; FPC thickness 0.18 or 0.3 mm; connector height 2, 2.4, 4.85 mm (vertical); contact positions from 6-60;

FH19C/19SC – ZIF connector; 0.5 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm (FH19C), 0.3 mm (FH19SC); connector height 0.9 mm; contact positions from 4-50;

FH23 – LIF connector; 0.3 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm; connector height 1.25 mm; contact positions from 15-71;

FH26 – ZIF connector; 0.3 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm; connector height 1 mm; contact positions from 13-71;

FH27 – ZIF connector; 0.4 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm; connector height 1.2 mm; contact positions from 10-60;

FH28 – ZIF connector; 0.5 mm bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.3 mm; connector height 2.55 mm; contact positions from 20-80;

FH34S – ZIF connector; 0.5 mm pitch; top contact point; horizontal mounting; back flip lock actuator; FPC thickness 0.3 mm; connector height 1 mm; contact positions from 4-34;

FH35 – ZIF connector; 0.3 mm top contact point; horizontal mounting; back flip lock actuator; FPC thickness 0.2 mm; connector height 0.9 mm; contact positions 19, 25, 33, 35, 45 and 51.

Hirose Electric Co. Ltd., www.hiroseusa.com  

 

Alpha CVP-520 solder paste is a Pb-free, no-clean, zero-halogen paste designed for pin-in-through-hole assembly of temperature-sensitive components. Reportedly reflows at peak temperatures of 155° to 190°C. Is said to provide fine feature printing on 0.30 mm circles at speeds up to 100 mm/sec., and in-circuit pin test yield. 

Cookson Electronics, www.alpha.cooksonelectronics.com  

Hirox's MX-BGAZ II Lens is said to perform easy, accurate BGA exterior observation. Allows ball joints to be observed nondestructively. Has 3-D optical rotary ring, including prism tip with lighting and a cushion mechanism to ensure comfortable observation. Helps specify such problems as overheating, oxidation and air foam formation. Inspects upper and lower ball joints Is capable of up to 180X magnification. Features spring-loaded lens tip to protect samples, and configurable and flexible lineup of lenses and peripheral devices.

Hirox/Seika Machinery, Inc., www.seikausa.com

XE-1000 series robotic soldering systems are for attaching tabbing and bus ribbon to crystalline silicon, amorphous silicon, CIGS and CdTe solar cells. Automate soldering process. Programmable control reportedly permits repeatable soldering over a wide range of format sizes. Can be used for either SnPb or Pb-free applications.

Christopher Associates Inc., www.christopherweb.com