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FLX2011-MK now comes with with a dual dispensers. One, a jet valve dispenser, for 0603 or smaller surface mount components and LEDs on flexible circuits, is said to quickly and accurately dispenses small glue dots, and is contactless. Also has Archimedean screw type for dispensing solder paste or conductive adhesives; or time/pressure dispenser, Piezoflow valve or jet valve, depending on the specific application.

Assembly head features optical centering system that can align SMD components, LEDs and metal domes, permitting flexible circuit production all on one system. Foils are held in position by a vacuum table. Working area is 500 x 300 mm; support area is 800 x 300 mm. Smaller foils can be clustered and be produced like a single foil. Integrated vision system automatically finds reference marks and corrects offset and distortion.

Essemtec, www.essemtec.com

Static pressure soldering technology is for Pb-free soldering large, high-density products. Enables Pb-free (SnAg3.0Cu0.5) soldering for products up to 490 x 510 mm in size and 6 mm in thickness. Ensures a decent soldering fill without damaging the PWB; enables partial soldering for insertion components.
 
OKI, www.oki.com

 

Miniature Linear Guides feature dowel holes on rail and block. Options include advanced (preload) and standard (interchangeable and small clearance) versions; long or wide blocks, standard or wide rail, all in a variety of dimensions, and varying guide rail with dowel hole lengths. Dowel holes on the rail enable easier positioning; balls remain retained even when the block is removed from the rail. Operating temperature range is from -20º to 80ºC.
 
Misumi USA Inc., www.misumiusa.com
 

 

Double barrel syringes are available in 2.5, 5 and 10 mL capacities; offered in 1:1, 4:1 and 10:1 ratios. Consist of a manual plunger, a dual-cylinder syringe and a static mixer, designed to work together. Are polypropylene. Prevent diffusion of two components.  Provide precise mixing and dispensing. Come in black. 
 
ConProTec, www.conprotec.com

 

A new market and technology study on integrated passive devices lists the existing and upcoming technologies and applications for IPDs. Provides an overview of the thin-film IPD market and growth opportunities. Details each market segment with drivers and benefits of IPDs, sub-segment size and expected growth rate, value chain analysis, and global market evaluation per application. Lists links between IPD technologies and their applications.
 
Yole Développement, www.yole.fr

 

Multi-Cure 9001-E Series encapsulants are said to cure in seconds; no mixing required and viscosity is consistent. Have high ionic purity, are solvent-free, and isocyanate-free. Have a low modulus. Contain no sharp, abrasive mineral or glass fillers. Reportedly display excellent adhesion to polyimide, PET, flexible PCBs, FR-4 and ceramic boards, and provide protection for glob top and chip-on-board applications. Are for encapsulating ICs in flex circuits.
 
Dymax Corp., www.dymax.com

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