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Pressurex is a thin flexible sensor film that reveals pressures from 2 - 43,200 PSI. When placed between the contacting surfaces of a flip chip bonder, it changes color directly proportional to the amount of pressure applied. Precise pressure magnitude and distribution is then determined by comparing color variation results to a color correlation chart.

Sensor Products Inc., www.sensorprod.com/pressurex

Model 780 spool valve reportedly provides a higher rate of fluid flow during dispensing.  Is designed to accommodate a broader range of fluids, including those possessing high viscosities. Is for fluid packaging operations, including filling vials, bottles and other specialty containers. Can be integrated into robotics and automated production processes. Possesses adjustable material suck-back and flow control. Is supplied with hard-coated aluminum components and Teflon seals. Comes in stainless steel and Teflon construction. Model 345 valve controller is ideally suited to actuate this valve.
 
Tridak, www.tridak.com

Sarcon SPG-30A is a high-viscosity, thermal interface silicone compound designed to transfer heat from a board-level source to a heat sink or heat spreader. Offers a thermal conductivity of 3.2 W/m°K. Also a thermal management option for electronic devices that operate at higher frequencies. Exhibits near-zero compression force and conforms to all component shapes and sizes. Is for filling large gaps around circuit board solder points. Requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range between -40º and 150ºC. Is available in 30cc tubes, 330cc cartridges and 10L pails. 
 
Fujipoly America Corp., www.fujipoly.com

 

Multicore HF108 is a Pb-free, halogen-free solder paste. Has high-speed print capability, a shelf life of up to six months when refrigerated or four weeks at room temperature, and a wide process window. 
 
Henkel, www.henkel.com/electronics

 

BM10 series FPC-to-board connectors are RoHS-compliant and halogen-free. Are available with stacking heights of 0.6 and 0.8 mm; feature 2.98 mm depth and 0.4 mm contact pitch. For use in printers, industrial controls, medical and instrumentation equipment, and multimedia devices. The 40-position connectors feature enhanced self-alignment mechanism via guidance ribs, with a self-alignment range of 0.3 mm. Have metal fittings and a clipping contact design.

Hirose Electric Co. Ltd., www.hiroseusa.com  

MCP screen printer has a head design with variable attack angle printing that reportedly permits constant solder pressure independent of stencil thickness. Single-head system reportedly reduces maintenance by half. Board cycle time is as low as 11 sec. Reduces defect per million figures by up to 50%. Has a flat-metal single-head squeegee. Variable angle print head improves repeatability of paste deposition for 01005 components. Produces solder shapes with stencil thickness down to 50 µm, and half-edging stencils with stencil steps of 30 to 50 µm. Is ideal for PCBs mixing 01005 (0.4 mm x 0.2 mm) types with larger component sizes.
 
Assembléon, www.assembleon.com

 

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