Circuits Assembly Online Magazine - Features

MH-900 Series material handler is multifunctional and configurable for inline or same-side load and unload operations. Supports single- and dual-lane conveyors, and provides loading and unloading of a variety of parts from very thin strips to large heavy boats and carriers. Includes programmable transport speed and carrier staging to maximize units per hour while multiple carrier sensors, active pinch wheels, and thin strip guides ensure safe handling. Elevator and shuttle operate independently with programmable speed to provide precise, high-speed movement. Comes with novel LoaderMove Touch Software and Control System. Offers scalability in loading options. Are fully enclosed with interlocked doors and windows for operator safety and part security. Can be fully integrated with the Spectrum S-900N series dispenser or operate independently with other SMEMA equipment.

Asymtek, www.asymtek.com

Fifth Axis Tilt (0 to 30 degrees) together with Four Position Rotate (0, 90, 180 and 270 degrees), are said to provide Film Coater applicators greater flexibility and increased access while conformal coating a printed circuit board. Tilt and rotate accessory is for coating vertical surfaces and underneath components. It enhances access to tight or hard-to-reach areas that may not be achievable with the standard downward approach (0 degrees). While the nozzle is tilted to 30 degrees, the mechanism can be rotated in 90-degree increments to direct the fan pattern to the left, right, front or back to coat all four sides of a component. Uses dual pneumatic motors for smooth, fast and quiet rotate action. Single action rotate speed is variable using flow controls. Is compatible with Select Coat SL-940E platform configured with Film Coater Applicators (SC-104/SC-105 or SC-204/SC-205).

Asymtek, www.asymtek.com

QX500 AOI has improved cycle times. Now includes SIM, enabling on-the-fly inspection.

SE500-X 3-D solder paste inspection now accommodates boards/panels measuring 100 x 100 mm up to 810 x 610 mm. SE500 and SE500-X 3-D can inspect pad sizes down to 01005.

CyberOptics Corp., www.cyberoptics.com

NL930 Pb-free, no-clean solder paste is said to feature good solderability, improve stencil life and provide superior cosmetics, especially when using SN100C. Offers print consistency with high process capability index and wetting characteristics. Post-reflow flux residues are penetrable. Is compatible with SN100C and SAC alloys with Type 3, 4 and 5 solder meshes, and with OSP, ENIG, immersion silver, and immersion tin finishes. Features high-volume repeatability with 16 mm pitch QFP pads and 12 mm circles, as well as good response to one-hour pause after two knead strokes at 35-65% RH.

FCT Assembly, www.fctassembly.com

VP4000 4-channel vapor phase temperature profiler has a low mass, hermetically sealed RF data-logger with heat-shield, measuring 130 x 60 x 40 mm. Is capable of passing directly through the preheat, vapor reflow and vacuum stages. Profile data are continuously passed to a PC via two-way wireless RF link. Profile can be viewed in real time as boards are being soldered.

AutoSeeker automatic reflow process optimization software reportedly eliminates trial-and-error approach. Given a user profile, it uses a rules-based algorithm to search for the best machine settings. User criteria such as process window centered, fastest throughput or lowest running costs can be defined.

Solderstar Pro RF wave and reflow profiling is for reflow and wave solder temperature profiling. This scalable system permits reflow profiling on 6, 9, 12 or 16 channels. When used in conjunction with the Waveshuttle wave solder process analyzer, it forms a wave analysis tool capable of detailed wave temperature profile and wave contact measurements. Incorporates an ultra-compact RF data-logger that provides a two-way RF data link with a PC. Permits system setup, process improvements and data downloads to be performed efficiently and temperature profile to be analyzed in real time.

SolderStar Ltd., www.solderstar.eu

ER2218 epoxy resin is a two-part encapsulation compound designed to meet UL94 flame retardency. Incorporates a novel flame retardant, resulting in an low viscosity flame retardant formulation. Is RoHS-compliant and non-halogenated and free of aromatic amines. Adheres to a variety of substrates, exhibits resistance to water and a variety of chemicals. Is reflow compatible. Comes in resin packs for air-free mixing of small volumes. Bulk product and resin kits will also be available for larger volumes.

Electrolube, www.electrolube.com