RP-113178 Pick-and-Place Underfilm enhances CSP and BGA solder joint reliability. Air or nitrogen reflow compatible. Requires no prebaking of boards. Is reportedly 100% reworkable and RoHS-compatible. Is said to reduce solder joint fatigue failures, and requires no additional cure cycle. Implement into design and manufacturing process by utilizing existing SMT Line and existing tape and reel feeders. Comes in standard EIA-481 carrier tape.
 
Alltemated Inc., www.alltemated.com
 

Stacked Die Tool software performs acoustic imaging to identify anomalies and defects in stacked die configurations. Can image all of the interfaces in a stack of eight die. Can sort out the correct echoes and provide acoustic imaging accuracy.
 
Sonoscan, www.sonoscan.com

VHX-600 Generation II digital microscope now features 16-bit imaging resolution. The brightness range has been increased from 256 levels to 65,536 levels. 3CCD color clarity has improved from 16 million to more than 2.8 trillion colors. Has high dynamic range function; graphic engine creates images in 16-bit gradation through the acquisition of RGB data from each pixel. The double'r automatic lens/zoom recognition system makes it possible for the VHX to recognize in real time which lens is mounted to the camera, and also the current magnification being viewed. Calibration is automatically adjusted when magnification is changed. Reportedly offers a depth-of-field at least 20x greater than conventional microscopes. Includes a pixel-shift actuator, achieving observation with resolution of up to 54 million pixels. Uses a flicker-free progressive scan method. Has a wide selection of high-resolution RZ optical design zoom lenses, with up to 5000x magnification.
 
Keyence Corp. of America, www.keyence.com

Alpha Nickel laser-cut nickel stencils are designed to provide 0.001" and 0.0005" stencil thicknesses for aperture printing, hard nickel for wear resistance, and positional and size accuracy. Features include flatness and low internal stress; custom thicknesses; mirror smooth board side finish; high repeatability and accuracy; fine-pitch printing (for print applications down to 0.4 mm pitch).
 
Cookson Electronics, www.cooksonelectronics.com