MicroLine 1000 E UV laser system is for separating thin or flexible assembled and unassembled panels. Is noncontact and reportedly does not affect conductors or components near the cutting channel. System software imports data directly from popular layout programs. Handles boards up to 229 x 305 mm (9” x 12”). Integrated vacuum table holds boards securely in position, with no need for further clamping devices; an advantage over conventional laser separation techniques for thin and flexible substrates.

LPKF, www.lpkf.com

MicroLine 1000 E UV laser system is for separating thin or flexible assembled and unassembled panels. Is noncontact and reportedly does not affect conductors or components near the cutting channel. System software imports data directly from popular layout programs. Handles boards up to 229 x 305 mm (9” x 12”). Integrated vacuum table holds boards securely in position, with no need for further clamping devices; an advantage over conventional laser separation techniques for thin and flexible substrates.

LPKF, www.lpkf.com

S3088-III AOI features enlarged inspectable PCB dimensions and improved camera technology. Is for economical electronics assembly inspection, from prototype to large series. Can be deployed for paste print or placement inspection. In high-resolution mode, reportedly detects defects on 01005 components. Revised PCB transport permits boards up to 20" x 20" to be inspected. Can be equipped for extreme cycle time requirements or heavier PCBs. Offers color evaluation for angled inspections. Comes with switchable resolution with the OnDemandHR function or integrated verification.
 
Viscom, www.viscom.com

MY100DX pick-and-place machine assembles components on high-mix boards at up to a reported 34,000 cph.

MY100SX handles batches or continuous production up to 21,500 cph.

MY100LX is for high mix operations.

Each now has higher-count feeders without no change in machine footprint. Work with Agilis intelligent feeders.

Mydata Automation, www.mydata.se