CN-1728 reworkable underfill encapsulant is designed to underfill package-on-package assemblies. Reportedly has a lower coefficient of thermal expansion, higher Tg, and better compatibility with flux residues. Is a fast-flowing capillary underfill with a viscosity of 900 cps; can be cured in as little as 1 min. at 150°C. Is suited for high-volume, high-speed inline processing. Rework is accomplished by use of temperatures between 170°C and 180°C to remove the underfill fillet. Then, the BGA is lifted from the board after heating it to reflow temperature. Underfill residue is easily scraped off.
Zymet Inc. www.zymet.com
The dual-head MC-385 pick-and-place system has IPC-9805 speed of up to 5,500 cph, plus expandability and compatibility features. Is for high-mix, mid-volume assembly. Uses Cognex flying vision and stationary bottom vision. Chip placement capability includes 0201s and flip chips, while AC motor and linear encoder combined with vision, ensure a placement accuracy of ±0.03 mm (±0.001"). Accommodates 64 smart tape feeders; up to 128 feeders are installable in the batch mode. Features high-precision ball-screw X-Y drive and closed-loop servo control with linear encoding.
Manncorp, www.manncorp.com/pick-and-place/mc385
The Model 780 spool valve reportedly provides a higher rate of fluid flow during dispensing. Is designed to accommodate a broader range of fluids, including those possessing high viscosities. Can be integrated into robotics and automated production processes. Has adjustable material suck-back and flow control. Is supplied with hard-coated aluminum components and Teflon seals, and is also available in stainless steel and Teflon construction.
Tridak, www.tridak.com
The point-and-shoot Mobile Hawk handheld imager is said to read any 2-D barcode, including direct part marks. Combines MAXlite machine vision illumination with X-Mode DPM algorithms. MAXlite leverages NERLITE experience in machine vision lighting with an integrated multi-axis lighting solution; delivers a plug-and-play mobile imager that is easy to use and reliable for low-contrast DPM applications. USB powered. Features a blue line targeting pattern for quick symbol location and easy barcode output into standard databases.
Microscan, www.microscan.com
iCure spot curing system is an inline fiber-optic system that provides heat by IR radiation in a portable unit, delivering accurate control for temperature-sensitive substrates and complex devices. Is made for automated manufacturing processes requiring adhesive curing and localized heating of bonded assemblies. Has a 200 W lamp with up to 90 W/cm2. Batch processes can be fully automated by attaching the flexible lightguide to a robotic arm. Applications include spot curing thermal epoxies; bonding and fixing plastic and glass components; fixing lenses; temporary fixing of miniature components; precision assembly and bonding of semiconductor components; focused energy for micro soldering, and localized heat welding of thermoplastics.
IRphotonics, www.icure-irphotonics.com
Is said to perform over 1,000 runs without degradation.
ECD, www.ecd.com/products/ovenchecker
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