SMTrue Run Optimize offline programming and management software module is for use with LS, LE, and CS SMT pick-and-place machines. Incorporates universal CAD translator with offline job and feeder setup, programming, optimization, and management. Converts industry standard, text delimited CAD files into a machine friendly component, location, and orientation database.
APS Novastar, www.apsgold.com
Alpha JP-500 is a Pb-free no-clean solder paste developed for use in the Mydata MY-500 jet printer. Is zero-halogen and -halide material, with a wide reflow profile window for good solderability on various board/component finishes. Reportedly has good and flux cosmetics after reflow soldering. Reduces random solder balling levels, and can be used for single- or double-reflow. Meets IPC-7095 Class III voiding performance. Does not require nitrogen.
Cookson Electronics, www.cooksonelectronics.com
FlashCORE III programming architecture is said to offer significant performance gains by increasing the download and read/write speeds by a factor of ten. Supports flash memory devices including SD, MMC, MoviNAND and iNAND. Is compatible with all existing FlashCORE algorithms and adapters; field upgrade kits are available for existing automated system installations.
Data I/O, www.dataio.com
Model 765 needle valve is suited for non-reactive adhesives, silicone oils, inks, and solvents. Can be used in processes such as device assembly, packaging, optics assembly, and building PCBs. Offers low maintenance and precision flow control. Is integratable into process automation and robotics. Optimal operation is achieved by using the Model 345 valve controller for valve actuation.
Tridak, www.tridak.com
The AT-GDP series BGA rework station has automated device removal and installation processes. Handles SnPb and Pb-free applications consisting of components such as BGAs, CSPs, QFNs, flip chips, and other SMDs. Enables placement to within 5 µm. Split Vision Optics permits simultaneous top of the PCB/bottom of the component viewing. Creates diagonal corner viewing for alignment of larger packages at high magnification. Absence of mirrors in the optics system reportedly ensures a clear image quality. Software contains a database of predefined profiles, which can be modified. Program settings can be adjusted while profile is running. Software controls reflow via forced air, nitrogen convection top heater, and large-area Quartz IR preheater.
Advanced Techniques US Inc., www.atco-us.com
IPC-2152, Standard for Determining Current-Carrying Capacity in Printed Board Design, is for determining the appropriate sizes of internal and external conductors as a function of the current-carrying capacity required and acceptable conductor temperature rise. Replaces IPC-2221 conductor sizing charts. Provides guidance on how thermal conductivity, vias, power dissipation, printed board material and thickness, and the presence of copper planes factor into the relationship between current, conductor size, and temperature. Establishes general guidelines for sizing conductors and contains simple charts that show testing results for both internal and external conductors in air and vacuum environments. Appendix explains how variables impact the temperature rise of a conductor, and presents charts based on copper weights. 97 pages.
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