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The SE500 series 100% 3-D solder paste inspection system reportedly has the ability to inspect assemblies at greater than 70 to 80 cm2 /sec. speeds. Inspect pad sizes down to 01005 (150 x 150 µm). Comes in two models, to accommodate different panel sizes. Features a conveyor that can transport panels from 50 x 50 mm to 510 x 510 mm. SE500X can transport panels from 100 x 100 mm to 810 x 610 mm. Standard features for both models include automatic conveyor width adjustment, mechanical board stop, 1- and 2-D multiple barcode read using the sensor, and process tracker SPC charts with alarm capability in the operator user interface. Has enhanced warp compensation for flexible circuits, the ability to handle odd-shaped pads, and an XML file format output. Can run program files originally created for SE 300 Ultra.
 
CyberOptics Corporation, www.cyberoptics.com

SelectaFlux Retrofit ultrasonic selective fluxing system has been designed to retrofit into all major selective soldering machines and is said to be compatible with all flux types, including Pb-free. Requires a simple trigger signal to operate and has controlled velocity spray. Combines Microspray ultrasonic atomizing nozzle with low air pressure. Spray is restricted through a separately controlled module that handles input and output. The distance between the nozzle and substrate can be varied from near-contact to approximately 50.8 mm. Contains a digital display for nozzle power and panel-mounted nozzle power, flow rate and air pressure adjustments, plus an alarm output for nozzle malfunction. Is 432 mm width x 305 mm height, and 221 mm diameter.
 
Sono-Tek, www.sono-tek.com

 

LMF Series fiber laser markers have high peak power and pulse frequencies; can mark text, barcodes or graphics and can be integrated into existing lines. Mark "on the fly," enabling marking/engraving of a moving product. Come in 10W and 20W versions capable of Q-switch frequencies of 2 to 500 kHz. Features include PC, touchscreen, standalone or pendant operation, intuitive and customizable marking interface, integrated rotary and XYZ motion, LAN connectivity, and an inline camera option.

Miyachi Unitek, www.muc.miyachi.com  

ProFlow Evolution enclosed print head adds ProFlow Tx, for alternative process applications, including deposition of enzymes, ink, underfill and glue; and ProFlow Atx, for advanced paste materials. Now able to mix and condition materials and deliver uniform performance control. Updates include the use of industry standard materials syringe packaging, a modified chamber design and direct material loading capability.
 
DEK, www.dek.com 

LTS-QFP is a programmable, automated machine that reconditions QFP and FP component leads for high reliability or RoHS applications. Has robotic part handling device that picks QFPs from a loading platform with a vacuum head. Component is inspected by camera for location. Flux is applied to the leads. Has two solder pots said to eliminate bridging. Is based on the LTS200 platform. Can be programmed to handle transistors, capacitors, diodes, axials, radials, pin grid array, sips, dips, connectors and more.
 
ACE Production Technologies Inc., www.ace-protech.com

Medalist i1000D in-circuit tester has digital test capabilities. Offers per pin programmability; digital PCF/VCL library-based testing; native boundary scan capabilities; I2C/SPI serial programming; simple, low-cost long-wired test fixture; and a flexible, easy-to-use GUI.

Comes with full native boundary scan test capabilities and VTEP v2.0 Powered vectorless test suite, including Cover-Extend.

Agilent Technologies, www.agilent.com 

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