Supra-E AOI uses iPro and comes standard with a 5-MP camera with Tri-Color illumination. Has resolutions between 7 and 17 µm; is capable of inspecting 01005 components to solder joint level. Is capable of board handling of 20 x 18". For low- to high-volume and low- to high-mix environments. Can reportedly be placed at any position in the production line without configuration changes. Programming times said to be 10 to 90 min.

Machine Vision Products Inc., www.machinevisionproducts.com

SMP200 Screen Printer includes precision stencil-to-board vision alignment for paste deposition and automatic PCB conveyor width adjustment to reduce setup and changeover time. A PCB alignment and clamping system coupled with advanced stencil separation control compliment the auto-leveling squeegee head system. Is said to have three-sigma accuracy. Has integrated under-stencil stencil wiping system with wet/dry/vacuum capability and second post-print inspection system.

Samsung Techwin, www.samsungtechwin.com

Dynatech Technology, www.dynatechsmt.com

LE40V automated pick-and-place machine is for prototyping and short run, high-mix manufacturing. Uses Cognex Vision. Provides on-the-fly component centering with top and bottom cameras, fiducial correction, bad board mark and pattern recognition. Reportedly provides accurate placement of 0201s, µBGAs, CSPs and 0.015 fine pitch QFPs at up to 3000 cph with ±0.001" placement accuracy. Includes self-contained vacuum.

APS Novastar, www.apsgold.com

SS4/ST4 series narrow body, super fine pitch low-profile board-level interconnects have a 4 mm wide socket strip and 5 mm wide terminal strip, with 0.4 mm pitch. Standard mated stack height is a low profile 4 mm from board-to-board with a choice of applications specific heights from 4.5 mm to 6 mm. Available with up to 40 positions per row in a double row design and rated at 7 GHz in single-ended and 4.5 GHz in differential pair configurations when mated.

Samtec, www.samtec.com