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Alpha Blade stainless steel squeegee blades are for surface mount printing. Said to eliminate design and manufacturing inconsistencies. Come in flat form in standard 6" to 22" lengths and thicknesses from 0.004" to 0.015". Custom flat squeegee designs available.

Cookson Electronics Assembly Materials, www.cooksonelectronics.com

Dual Lane Vision X Series convection soldering system enables simultaneous lead- and Pb-free reflow in a single machine. Comes with two conveyor lanes that can be operated asynchronously at different speeds and asymmetrically with different lane widths. Can be loaded with diverse PCBs printed with different solder pastes, while a flexible heating system enables the selection of ideal reflow profiles for the separate products. Homogenous, non-separated heating and cooling zones across the entire width of the conveyor are said to increase operating convenience and reduce investment cost. Comes with air or nitrogen atmosphere and integrated residue management system.

Rehm Thermal Systems, www.rehm-group.com
X3 x-ray and AOI comes with proprietary tomographic imaging technology for gathering multiple oblique images to digitally construct 3-D renderings. Offers unobstructed inspection of solder- and component-related defects on double-sided boards. Multiple slices, or inspection planes, can be generated from the same set of oblique images at any time. Selectively uses 2-D or 3-D x-ray. Programming said to take less than 45 min. For in- or off-line.

Yestech, www.yestechinc.com

FlexSolder S3532 is for high-speed stamp soldering a controlled nitrogen atmosphere. Is said to provide advantages over typical multi-flow types; does not use any pumps, and is fast and clean, with no overspray. Top and bottom contour plates keep the PCB in place in X, Y and Z, and control board warpage caused by either previous double-sided reflow or the PCB characteristics. Requires minimal programming; no CAD, Gerber or other data needed.

Juki Corp., www.jas-smt.com

RED-E-SET board support reportedly can reduce component damage caused by misaligned bottom-side board support tooling or placement pressures. Is for screen printers, dispensers and automated assembly machines. Can reportedly be configured in fewer than three minutes. Is said to provide zero defects; eliminates board flex using a spring-loaded support pin system.

Production Solutions Inc., www.production-solutions.com

SE500 3-D solder paste inspection system inspects assemblies with a >70 cm2/sec. inspection speed. Can inspect pad sizes down to 01005. Has two models that accommodate different panel sizes. Features a conveyor that can transport panels from 50 x 50 mm up to 510 x 510 mm. SE500X can transport panels from 100 x 100 mm up to 810 x 610 mm. Features for both models include automatic conveyor width adjustment, mechanical board stop, 1- and 2-D multiple barcode read using the sensor, and Process Tracker SPC charts with alarm capability.

CyberOptics Corp., www.cyberoptics.com

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