The EKRA Enhanced Evaluation system is said to provide 100% inspection at line rate speeds. Features parallax-free optics and rectified imaging; permits a full shadow-free image of the substrate and automatic comparison of the print to the stencil CAD data. Scans and analyzes a PCB of 400 mm x 300 mm within 25 sec. at a resolution of 21 µm.
Three instruments are handheld capacitance and LCR (inductance, capacitance, resistance) meters for easy access to component testing; the fourth is a handheld multi-function calibrator/meter that provides two-in-one functionality for on-the-go characterization of process-control devices. The U1701A capacitance meter and U1731A/U1732A LCR meters include one-touch measurements, tolerance testing (with visual and audible indication), value recording (with min., max. and average), and a dual display. U1401A features include simultaneous source-and-measure capability, full-span DMM measurement and recording functions, and a backlit dual display.
SN100C P520 D5 Pb-free solder paste is said to reduce shrinkage defects, slow intermetallic growth, and offer high-impact strength for 0402 components. Reportedly reflows with minute solder volumes, wets on all common substrates, exhibits minimal cracking of flux residue, and has good hot slump performance.
Extra Fine Solder Wire SN100C (030) reportedly provides sharp spreading and good separation. Is said to reduce bridging in soldering extra fine coaxial harnessing in cellphones. Has a diameter of 0.1 mm. Properties include inhibition of growth of intermetallic layer and low copper erosion.
X5Pro printer is an updated release of the X5 platform. Provides an expanded board size capability and updated I/O system. Is compatible with IPAG integrated paste and glue dispensing system and 2½ D Plus high-speed inspection system. Uses a high-speed servo vision drive system.
Progressive Energy
Dynamics fluid delivery technology comes on the MicroJet defluxer and is said to offer maximum
impingement energy and fluid flow around and under SMT components.
Independently targeted, precision flow jets impact all four sides of circuit
card assemblies and SMT components as they travel through the wash. Can clean low
standoff BGAs and microBGAs.