The VT-S700 inline AOI system uses a telecentric lens with a 2-MP camera. Is said to reduce image distortion and improve inspection accuracy at the edges of large field-of-view. Delivers inspection of up to 10 µm for components as small as 01005 and down to -0.012" pitch. Uses three-color highlight system that illuminates PCB in a 360° dome. 3-CCD camera enhances solder shape recognition accuracy. Other features include color-enhancing capability, integrated graphical user interface and logic customization. Optical character verification is available. Resolution can be selected for 10, 15 or 20 µm. Separate models are available to handle 10 x 13" and 18 x 20" boards.
Elpeguard SL 1307 conformal coatings are
yellowing-resistant, and based on polyacrylic resins. The cured lacquer film
can be removed with thinner for repair purposes. Are thixotropic, based on SL
1307 FLZ, which is suited for the partitioning/covering of plug connectors.
Have been improved for spray application; can also be used for dipping at
higher temperatures. Exhibit good wetting.
The XD7600NT100 digital x-ray inspection system
has 0.1 µm feature recognition for finite analysis of inspection applications.
Is equipped with a 2M pixel camera; offers oblique angle viewing of up to 70°
in any position around any point of a 16 x 18" inspection area. Is
configured with dual monitors: combines a 24" widescreen LCD monitor with
the navigation map on a 20" flat panel LCD display. Is available with a
tube combining 10W of power and submicron feature recognition. Can be equipped with CT providing 3-D
modeling and volumetric measurement of solder joints. Is suited for analytical
analysis of solder interconnections for critical applications such as stacked
die, MEMS, package-in-package and package-on-package.
The
SMD Tower is a flexible, automated, expandable buffer storage
unit designed for production lines. Is said to correctly stores components
in a controlled atmosphere, ready for a quick, smooth line changeover. Database records movements
and tracks all stored reels and component quantities for single reel or tray, and automatically processes a complete kitting list or an
entire component assembly program. Uses a unique
identification code to ensure the correct article is always provided or
stored, eliminating component mixups. Return-to-storage is said to be quick and convenient.
Embedded Passives: An Overview of Implementation, Benefits and Costs is a white paper providing information about the cost/value proposition of this evolving technology. Provides guidance for engineers, executives and others considering embedded passives to evaluate the technology; has general information on how to proceed with implementation. Contains 20 pages; summarizes formed embedded passives and addresses physical considerations, quality and reliability considerations, performance gains, implementation costs and cost advantages, and design impacts for circuit boards with embedded components. Features 24 figures and tables.
KISS 101A is ready for Pb-free soldering, and reportedly can reduce hand-soldering operations by up to a factor of 10. Is programmable in X, Y and Z. Utilizes original Laser Point teach-and-align process. Features optional Pb-free-compatible solder pot. A variety of standard and custom nozzles are available, from a 3 mm bullet nozzle to a 3" wide wave. Is a benchtop model and accommodates PCBs from 2 x 2" up to 12 x 12", and connectors up to 10" long.