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Bioact EC-88 Defluxer is made with AquaEdge technology. Is recommended for cleaning Pb-free, no-clean and high-temperature solder pastes. Is said to have high flux loading capacity, low foaming property and low environmental impact. Used with aqueous spray equipment. 
 
Petroferm, www.petroferm.com
DispenseJet DJ-9500 is for high-speed underfill applications and jetting silicone for LEDs. Flexible pneumatic design enables jetting a wider range of fluid types, reportedly at up to 10 times faster than needle type dispensers, with better repeatability and increased flexibility.
 
Asymtek, www.asymtek.com

VacuNest shape memory board support system is said to handle large board products up to 450 x 450 mm, including backplanes, solar and fuel cell panels and multiple substrate printing. Designed to eliminate problems associated with conventional dedicated or programmable pin tooling systems. Each module consists of a pliable, anti-static chamber containing a foam former surrounded by polymer granules. The chamber can be profiled to match the contours of different populated board undersides. Under vacuum, that profile can be locked into place indefinitely without shrinkage. Releasing the vacuum, manufacturers can reset the nest as an elastic material brings the chamber back to its original position.
 
Novatec EAP, www.novatec-eap.com
 
 
SP200-AV2 stencil printer includes Trans-Stencil-Vision; has PCB shuttle mechanism. The upper part of the machine frame contains vision cameras, the print head and the stencil-frame guide. Squeegee does not have to be removed for stencil change. Vision cameras look directly through the stencil apertures to the PCB. Cameras are mounted with spring-operated clamps. Print head comes standard with a continually operating squeegee-pressure control. Metal and synthetic squeegee blades can be used. Offers a 23" stencil frame system with a print area of 360 x 400 mm. Includes theft-proof laptop. Software runs on Windows XP.
 
Essemtec AG, www.essemtec.com
 
SN100e Pb-free solder is manufactured from tin, copper and cobalt. Is RoHS-compliant and reportedly reduces copper dissolution. Is said to provide brighter, shinier solder joints compared to SAC alloys. Is compatible with all SAC and SnCu alloys. Performs with ENIG, immersion tin, immersion silver, OSP, and HAL board finishes. Meets requirements of J-STD-006.
 
Qualitek International, www.qualitek.com
 
KIC 24/7 thermal management system now comes standard with a feature that reportedly transforms a reflow oven to a transparent process tool. Generates reports for defects per million opportunities and reflow process yield. This information is said to be instantly understandable.
 
KIC, www.kicthermal.com
 

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