The VWP-500 wafer pen is said to accept all of the company’s press-fit wafer tips and an adaptor that accommodates die/SMT handling tips. Available for handling wafer sizes from 2" to 12" in diameter, and for 1/16" ID or 1/8" ID vacuum hoses. Is available as a standalone wafer pen or as a kit with vacuum hose, holder, vacuum source and wafer tip.
VisualCAM 2006 and GerbTool 15.2 feature version 8.0 ODB++; flip panel; IPC-D-356B support; nearly 200 enhancements and defect fixes; ability to “see through” composite layers, and flying probe test point generation. Choose to export full IPC D-356/A/B (with 099 records for test points) or scaled-back version with test point features only.
Kester 295 No-Clean Flux is free of halides and bromides. Designed for cored solder wire. Tested to conform to IPC-TM-650, IEC61189-2, J-STD-004A and JPCA-ES-01, with no chlorine and bromine detected. Designed with blend of rosin and proprietary activator system. Reportedly eliminates splattering and the need for cleaning. Residues are non-conductive and non-corrosive. Is available in a variety of alloys, wire diameters and flux percentages. Is classified as type ROLO flux. Can be used for both lead and Pb-free soldering. Recommended solder iron tip temperature: 260°C to 370°C for Sn63Pb37 and 350°C to 400°C for Pb-free SnAgCu alloys.
A solder analysis and identification feature has been added to the LeadTracer-RoHS XRF system. Is said to accurately identify all solder alloys within minutes. Performs a solder pot analysis, permitting users to track changes. Addresses potential weak links in production chain, including boards for second-side assembly on a non-continuous line; boards taken off-line for inspection and analysis; reflow boards moving to wave or selective soldering; boards split into two batches because of line shortages; boards moving from production to rework areas; boards held for missing parts or for component recovery; components held in rework areas, and components from placement reject trays.
SchmartSolder is said to make hand-soldering through-hole components simple. Is loops of solder produced to fit over component leads. Reportedly melts and flows into the hole quickly.
The scanner-based FA-Inspector optical inspection system uses a high-res scanner and computer-based image processor to provide image acquisition, fault identification and SPC reporting. Incorporates proprietary optics, custom illumination and AOI Software. Board handling is said to be up to 19" x 24" with area of inspection of 11" x 16" in a single scan. Defect coverage includes SMT and PTH parts down to 0402, part presence/absence verification, part polarity and pin #1 orientation, part position and skew errors, laser marking, wrong part and device differences. Two modes of operation: AOI and Comparator.