A new, longer Pyramax reflow oven features 350ºC maximum temperature, a flexible platform configuration and a comprehensive menu of options. Capabilities include reduced nitrogen consumption and lower power use. Features closed-loop convection control.
 
BTU International, www.btu.com
 

 

Flashstream will support up to 32 Gb by year-end. Speed has incorporated use of cache-programming modes in select devices, reportedly pushing top speed on NAND memory to 8.23 Mb per sec. data transfer during programming. Now supports MLC flash memory using a bit error rate tolerance method. Managed NAND architecture like eSD/eMMC such as Samsung MoviNAND, Micron e-MMC, and Sandisk iNAND are now supported. Vector Engine has been enhanced with address-data multiplexed (A/D MUX) NOR devices. Bad block management options in the BPWin software have been enhanced; reportedly more than 90% of “standard” bad block management schemes can be addressed without the need for customization. Bad block parameters permanently can be recorded to the master-programming file and transferred to manufacturing facilities globally. Now available in multiple automated handling systems.
 

This thermal die lid attach adhesive is said to replace using two existing materials, such as a thermal interface material and a lid attach adhesive. Uses non-silicone polymer. Polymer is filled for high conductivity; additives are used to improve material properties. Reportedly shows little or no change in thermal conductivity, as measured by laser flash methods and adhesion, based on shear testing, after 150 cycles under standard reliability testing. 
 
Lord Corp., www.lord.com