Circuits Assembly Online Magazine - Features

A radio frequency version of the Explorer thermal profiler beams profile data in real-time to the computer, as the profiler runs through the reflow oven or wave solder machine. Instantly shows what is going on with the process. There is said to be less potential stress to the profiler or production board; any over-temp situation is instantly revealed. Alerts operator to such pitfalls as forgetting to turn on prior to a run; when a TC pops off; wrong oven recipe, and when profiler gets stuck in the oven tunnel.

KIC, www.kicthermal.com

The Mixpac F System consists of a manual or pneumatic dispensing gun, a cartridge and a static mixer, all designed to work together. Cartridge dispensing systems are used to dispense two-component adhesives in a variety of volumetric ratios. Features a nose plug interface. Permits mixing and dispensing of high-viscosity adhesives.

ConProTec Inc., www.conprotec.com

Qualitek 355-35 no-clean, Bellcore-compliant liquid flux is a rosin-free, halide-free, halogen-free, VOC-free flux designed for high-temperature Pb-free applications. Is said to promote fast wetting and maximum wetting spread; eliminates skips and shorts in wave solder assembly. Designed for spray applications. Delivers topside hole fill with OSP coated bare copper boards.

Qualitek International Inc., www.qualitek.com

V-M.O.L.E. is a thermal profiler designed to complement MegaM.O.L.E. 20, SuperM.O.L.E. Gold, and oven profilers such as OvenRIDER and OvenWatch. Has one-touch profile verification. Warnings are given on batteries, core temperature, and TC connectivity. Reportedly simplifies verification of a target profile through placement of a minimal number of thermocouples. Is powered by MAP software.

ECD, www.ecd.com

Scapa 815 is a heat-resistant, non-silicone tape said to withstand temperatures up to 350°F. Is designed to mask and hold tools, forms and parts for metal and composite bonding, and for masking PCB contacts during conformal coating. Consists of a high-temperature nylon backing, single coated with a rubber adhesive that reportedly eliminates the potential for silicone contamination. Is 0.0032" thick.

Scapa North America, www.scapana.com

DSP862 no-clean Pb-free solder paste is said to have a broad processing window and accommodates a range of applications. Complies with ROL0 IPC and IPC Class III. Available in standard form as well as green for SAC and most other Pb-free alloys. Has brick definition, extended stencil life and “response-to-pause” time. Provides print speed window from 25 to 150 mm/sec. Handles CSP and QFN on a Pb-free board finishes, OSP-Cu, immersion Ag, immersion Sn, ENIG and LF HASL. Reportedly will perform for at least 8 hr. of continuous printing. Is said to yield no or low solder beading and solder bridging. PWB assemblies in both air and nitrogen reflow using straight ramp or soak profiles up to 200°C. Tack life said to be greater than 48 hr.

Qualitek International Inc., www.qualitek.com