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WS170 water-soluble solder paste is intended for Sn62/Sn63 applications. Reportedly produces fully wetted, shiny solder joints, and has the activity necessary to solder to common hard-to-wet alloys such as gold, platinum, palladium, silver, Alloy 42 and bare copper. Print speeds of up to 6"/sec. have been tested with full aperture fill and no slumping noticed. Benefits are said to include non-hygroscopic formulation, broad process window, 24-hr. stencil life and tack time, minimal to no foam when cleaned, easy-to-clean post-process residues, excellent wetting, repeatable paste deposition, and compatibility with all plating types. Provides up to 8 hrs. response-to-pause time without print degradation.
 
FCT Assembly, www.fctassembly.com

SMT3000LD automatic defluxer and cleanliness tester is reportedly capable of removing all flux residues, including rosin, no-clean and water-soluble, lead and Pb-free. Is equipped with automatic chemical injection and closed-loop wash solution recycling systems. Wash solution is heated automatically and sprayed onto assemblies; is directed back to holding tank for reuse. Rinse water is sprayed onto assemblies, is directed through the pre-drain filtration system and sent to drain. Assemblies are dried via on-board convection and radiant forced air-drying system. Standard features include programmable maintenance reminders, remote SPC viewing, SPC data USB export and a built-in chemical management system. Zero-discharge evaporation system is optional. Is said to be capable of defluxing and cleanliness testing up to 200 101 x 152 mm boards and up to 28 457 x 508 mm boards per hr.
 
Aqueous Technologies Corp., www.aqueoustech.com
Ablestik 8000 Wafer Backside Coating is said to permit efficient coating of the back of wafers with die attach materials down to 20 µm in thickness. Also permits bondline thickness control to customer specifications, maximization of chip footprint through the elimination of the fillet and repeatable material uniformity. Available in conductive and non-conductive formulations; engineered to address the requirements of smaller die sizes (less than 3 mm x 3 mm), enabling production of packages such as COLs, SOs, TSOPs and QFNs. Printing process and full coating of the wafer backside reportedly can take place in as little as 10 sec.; coating thicknesses of 20 µm on wafers as thin as 100 µm and up to 300 mm in diameter.
Icon i8 fully automatic screen printer now includes an under-stencil cleaner. Features dual-vacuum cleaning changers. Solvent holes tube now is said to be easier to remove from the main under-stencil cleaner body. Offers pad-on-pad verification, using DEK Hawkeye camera and inspection software.
 
Icon Technologies, www.iconprinter.com
 
Kester 295 no-clean flux is halide- and bromide-free. Designed for cored solder wire. Conforms to IPC-TM-650, IEC61189-2, J-STD-004A and JPCA-ES-01. Is said to eliminate splattering; removes need for expensive cleaning. Residues are non-conductive and non-corrosive and do not require removal. Is available in a variety of alloys, wire diameters and flux percentages. Classified as type ROLO flux per J-STD-004A; can be used for Pb- and Pb-free soldering. Emits low smoke and odor. Recommend solder iron tip temperature ranging between 260-370°C for Sn63Pb37 and 350-400°C for Pb-free SnAgCu alloys.
 
Kester, www.kester.com
 
Tape dispenser (item 81282) was designed for ESD tapes. Is made of stainless steel and holds tapes with 3" cores. Two separate spools turn independently to hold either a single 2" wide roll or two rolls 1" wide or narrower. All components can be grounded with ground cord. An integrated grounding jack can be used to plug in a wrist strap. 
 
Desco, www.desco.com
 

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