The 2008 Aerospace/Defense Symposium papers are now available free on CD. The fifteen technical papers reflect two tracks: test system development and military communications test. Also included is information on wideband vector analyzer calibration issues and time interval analysis measurements for radar.
The DispenseJet DJ-9500 fluid jetting valve is for high-speed underfill applications and jetting silicone for LEDs. Has a flexible pneumatic design. Reportedly can jet a wide variety of fluids up to 10 times faster than existing needle type dispensers. Controls fluid break-off at the nozzle tip. The needle assembly is said to last 5 to 10 times longer than other tested assemblies. Enhanced temperature controls maintain the fluid at a consistent viscosity.
Asymtek, www.asymtek.com
ZIP contacts for semiconductor test feature planar contact surfaces produced by test pin manufacturing processes. The Z Interconnect Pin is available in three design configurations: radial, flat, and hybrid. Radial uses machined 3-D components; flat employs 2-D components, and hybrid combines both. Are designed for interchangeability in the same test tool. Available for 0.5, 0.8, and 1.0 mm test pitches with 1.27, 0.4, and 0.3 mm designs.
Everett Charles Technologies, www.ectinfo.com
ProLINE-RoadRunner XLF inline automated programmer programs flash memory and microcontroller devices using FlashCORE II. Extra large format supports device sizes up to 32 mm sq. and tape widths of 32 mm and 44 mm. Can be reconfigured to support small- to medium-sized devices in tape widths of 16 mm and 24 mm. Features automatic supply application software. Initially available exclusively for Siemens assembly machines.
Data I/O Corp., www.dataio.com
Data I/O Corp., www.dataio.com
The upgraded YTV F1 Series AOI inspects solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Is said to be for high-volume or high-mix manufacturing environments; also for pre/post-reflow applications. Has four oblique viewing cameras; offers inspection for R-nets. Improved Fusion lighting, with multi-color solder joint inspection, reportedly delivers 20% higher detection capabilities compared to previous models. Offers offline programming and a standard package library. Real-time SPC monitoring is standard.
YESTech Inc., www.yestechinc.com
YESTech Inc., www.yestechinc.com
The PC3200 series of fast-setting, one-component conductive adhesives is for connecting passive components and bare dies on lead frames and PCB substrates. Uses are said to include smart cards and flexible circuits found in camera phones, automotive or semiconductor applications. Is a one-part system that reportedly requires no premixing. Does not have to be stored below 40ºC, nor shipped in dry ice. Solvent-free and formulated for stencil print, screen printing or dispensing applications.
Heraeus Contact Materials Division, www.4cmd.com/circuitmaterials
Press Releases
- AIM to Present on Micro/MiniLED Applications at Hangjia Talk in Shenzhen, China
- Indium Corporation Receives Business/Industry Partnership Award by NYCCT
- Libra Industries Expands Powder Coating Capabilities at Guaymas Facility
- Scanfil and Etteplan Improve Product Life Cycle and Manufacturability with Redesign