Circuits Assembly Online Magazine - Features

Gelease material has some cross-linking; reportedly has strength to stay in place and does not pump out. Gel is soft; absorbs movement of surfaces caused by CTE differences of assembled parts. Is built on the same cure chemistry as MG121, but reportedly offers higher conductivity, lower modulus and an improved thermal conductivity value (3.8 W/mK). Was designed for syringe dispensing or stencil printing. Is said to be ideal for automotive and consumer electronics.

Lord Corp., www.lord.com

ME-542 thermally conductive flip chip underfill is said to offer improved thermal path for heat reduction. Was designed to achieve high reliability for in-package or chip-on-board applications and to increase thermal dissipation from the die into the substrate. Has high copper content in substrate. Has thermal conductivity of 0.8 W/mK, a reported 500% increase over standard underfill products. Is engineered to quickly flow into gaps less than 25 µm with minimal filler settling and no voiding, encapsulating interconnect arrays with a layer of protective polymer.

Lord Corp., www.lord.com

5W and 6W high-conductivity thermal greases are designed to maximize heat transfer from high-end chips to the heat spreader. Are solvent-free. When heated, viscosity reduces. Reportedly used mathematical modeling to speed up development process and determine ideal packing of the filler particles for size and ratio. Is said to be ideal for automotive and consumer electronics.

Lord Corp., www.lord.com

The DX dispensing system includes a mobile handheld dispenser with a refill station for two-component materials. Is said to dispense a variety of ratios. Multiple handheld dispensers can be refilled with one refill station; uses two transfer pumps that feed from 5 gal. bulk containers, each equipped with follower plates.

Mixpac Equipment Inc., www.mixpacequipment.com

BluePrint for PCBs Version 2.0 documentation-authoring tool automates the creation of documentation that drives PCB fabrication, assembly and inspection processes. Now integrates with CAM350. Reportedly can be used to create and distribute all the deliverables required for a PCB fabrication and assembly release package in one electronic file. Supports a module for panel document creation. Includes flip panel; universal release package navigator; CAM350 embedding, and usability updates.

DownStream Technologies, www.downstreamtech.com

Series 500 ultrasonic stencil cleaners are designed for fine-pitch, low-volume stencils. Are said to be entry-level for users not able to purchase a fully automatic system; reportedly offer similar cleaning results. Are equipped standard with a heated wash and other basic requirements for cleaning Pb-free solder paste, pallets and adhesives. Can be customized. Model 520 cleans up to 20" stencils; Model 529 cleans larger stencils.

Smart Sonic, www.SmartSonic.com