The enhanced 4000HS High-Speed Bondtester includes high-speed trigger capture software and a rising table work holder for cold bump pull bondtesting. Provides energy measurements during bondtesting. Is JEDEC-compliant.
KIC Explorer 9 thermal profiler uses modern hardware and features a total of nine thermocouples using the standard type K TC connectors. The channel completes the range of compact profilers. Software is said to be easy to use. The optional auto-focus process optimization software automatically selects the best oven setup for each application.
Zestron DS 100 solvent-based defluxing agent is for water-free and low-temperature cleaning applications. Is designed to remove flux residues from assemblies, ceramic hybrids, power modules and leadframes in self-regenerative closed-loop cleaning systems. Is said to ensure extended bath life, short cycle times and residue-free drying. Is halogen-free; meets new RoHS and WEEE guidelines.
e.dot+ compact electric hot melt adhesive guns are said to offer a combination of accurate dot or bead placement, easy installation and quiet operation, while requiring minimal space for installation and service. Reportedly ideal for high-speed dotting applications. Operate in combination with a small diameter hose and an external gun driver, permitting direct plug-and-play connections between the adhesive melter, gun, driver and hose. Are said to have on-times as low as 0.4 ms, cycle rates as fast as 1.8 ms, and a service life in excess of 200 million cycles. Features a removable armature and seat, and a number of interchangeable nozzles. Manual stroke adjustment permits re-zeroing of the module after servicing.
A dummy version of Amkor's FusionQuad lead frame-based plastic package is available. Is based on the addition of exposed bottom lands within a standard VQFP package format. Is said to extend the I/O range of classic leadframe packaging to nearly 400 unique pins; delivers an approximate 50% reduction in package size for a given leadcount. Reportedly provides short signal paths to bottom lands and high power dissipation capability with the solderable exposed die attach paddle.