S6053BO-V fully automatic wire bond inspection system is for small wire bond analysis. The camera technology and the transport reportedly can be adapted to varying production demands. Is equipped with a universal, high-resolution VHR camera module. Can inspect down to 2 to 5 µm per pixel. Camera module can be arrayed with one or several cameras and illumination units. Bond wires smaller than 20 µm in diameter can be inspected 100%. Is available in a dual track configuration, including an integrated shuttle that loads the second track as an inspection is conducted on the first track. Is configured for fine bond wire analyses. Also said to inspect components and ASICs with high accuracy.
Easy Lift is an ergonomic workbench with 20" of adjustable work surface. Serves as a workbench, assembly station and adjustable desk. This ESD-safe work surface is approved for static-sensitive electronics assembly and non-ESD applications. The table moves vertically and has a 250 lb. load capacity. Comes standard with a 24 x 30" static dissipative powder-coated steel tabletop with ESD-safe Blue Softsurface matting material. Has foot pedal and adjusts from 19" to 39".
LiveBOM is an interactive bill of materials functionality within PCB123 design software. Provides real-time pricing, availability and technical part information from Digi-Key. Also tracks the rolled up per-board pricing and quantity for each design based on part number.
The 2D Inspection (2Di) V9 software tool monitors the print process. Is said to inspect boards or stencils to determine if print quality is deteriorating. Permits operators to identify when a stencil clean or paste dispense is required, and prevent bridging, misalignment, stencil smear, stencil blockage and reduced paste volume. Includes simple setup, on-board guidance, enhanced operator prompts and automated post-print inspection feedback highlighting sites requiring attention. Has full-page zoom function.
VP5000 inline 3-D SPI system has a large field of view said to reduce the number of images required to inspect the board. Has tabbed menus in touch screen interface. Includes warning thresholds to the pass/fail outputs. Comes with an interface to Qup-Navi software that enables the height calculation and volumetric inspection data to be incorporated into a root cause of failure analysis. Uses color stripe phase shift method. Combines RGB (red-green-blue) light sources and a 3-CCD camera with texture mapping or gradation displays. Inspects for average height, volume, excessive deposition, insufficient solder, smearing, misalignment and bridging. Has an interface to import Gerber and CAD data. Locations of defective pads are displayed on the substrate map with up to eight raw images of defective pads. Multi-data station 5000DS uses one PC and can handle up to six machines for off-line programming and analysis of production data, line status, and machine waiting time for parts. Accepts substrates from 2" x 2" up to 18" x 20" and provides 12 µm resolution with a 23 x 31 mm field of view. A 2-D code reading option enables the camera to read Data Matrix (ECC200) and QR (Model 2) codes.
Auto-Dip Pb-free solder dipping is a benchtop, fixtureless system that simulates the action of a wave without dislodging components when boards, retained by a grid of needle supports, are dipped into the solder bath. Solder is then evenly applied while surface tension “floats” the PCBs at the correct through-hole wetting height. Single boards or pallets of up to 19.3" x 12.5" are processed in 2 to 12 sec. Activation is microprocessor-controlled with startup and shutdown times pre-settable for intervals up to one week. Adjusts for dwell time, Pb-free compatible temperatures from 220º to 299º C, and dipping angle. A built-in motorized skimmer removes dross as needed.