Alpha POP-959 Pb-Free, no-clean solder paste is designed to deliver repeatable paste volumes for PoP assembly. Provides flux and solder powder. Designed to minimize expensive rework and scrap. Is said to offer resistance to shear forces associated with PoP dip application equipment. Reportedly maintains rheology for at least 24 hrs. Is said to be ideal for 150 to 300 µ offset chip scale packages, while leaving a clear, colorless, residue with high electrical resistivity.
Cookson Electronics Assembly Materials, www.cooksonelectronics.com
The KDS-101 bench-top solder dross recovery system from Koki Tec Corp. recovers purified solder from dross in all soldering operations. Recovered solder can be immediately reused and dross disposed of efficiently.
Christopher Associates Inc., www.christopherweb.com
Trident III is an automatic defluxing and cleanliness testing system said to be capable of removing all flux residues, including rosin, no-clean and water-soluble. Both lead and Pb-free flux residues may be removed. Is equipped with automatic chemical injection system that automatically adds a programmable volume of defluxing chemical to wash water. Has a closed-loop wash solution recycling system. Is equipped with programmable maintenance reminders, remote SPC viewing, SPC data USB export and a built-in chemical management system. An optional zero-discharge evaporation system eliminates connection to a drain line. Is reportedly the fastest batch-format defluxing system available. Throughput rate determined by board size. Is capable of defluxing and cleanliness testing up to 200 4" x 6" boards and up to 28 18" x 20" boards per hr.
Aqueous Technologies, www.aqueoustech.com
Aqueous Technologies, www.aqueoustech.com
Mobile See-Flo 202 meter system is a cart-mounted positive-displacement meter-mix dispensing system designed to apply precision beads and small, metered shots of mixed resins such as epoxies, acrylics, urethanes and silicones. Is used in two-component bonding, gasketing, potting and sealing applications in manual, automated, indexing and robotic processes. Self-contained mobile system includes supply tanks or pumps, the meter and manual or automatic mix-dispense valve. Has air-over-oil drive adjustable drive motor and disposable No-Flush motionless mixers.
Sealant Equipment & Engineering, Inc. www.sealantequipment.com
Pink ESD Wipes are said to feature a surface resistivity of 109 ohms, as well as low-linting characteristics. Are comprised of 100% ESD-safe virgin polyester fabric; weigh 115 g/m² and have a thickness of 0.016 mm. Reportedly have a tensile strength of more than 10 kg and will absorb 2.13 ml of liquid per gram. Available in 9" x 9", the wipes come 150/bag.
High-Tech Conversions Inc., www.high-techconversions.com
WS170 water-soluble solder paste is intended for Sn62/Sn63 applications. Reportedly produces fully wetted, shiny solder joints, and has the activity necessary to solder to common hard-to-wet alloys such as gold, platinum, palladium, silver, Alloy 42 and bare copper. Print speeds of up to 6"/sec. have been tested with full aperture fill and no slumping noticed. Benefits are said to include non-hygroscopic formulation, broad process window, 24-hr. stencil life and tack time, minimal to no foam when cleaned, easy-to-clean post-process residues, excellent wetting, repeatable paste deposition, and compatibility with all plating types. Provides up to 8 hrs. response-to-pause time without print degradation.
FCT Assembly, www.fctassembly.com
Press Releases
- ITW EAE Achieves ISO 14001 Certification Across All Manufacturing Sites
- AIM to Participate in SMTA Ultra High Density Interconnect Symposium
- Bimos Welcomes Nick Weatherspoon as Business Development Manager
- Creation Technologies Announces Leadership Transition: Patrick L. Freytag Named as Chief Executive Officer