Circuits Assembly Online Magazine - Features

The upgraded YTV F1 Series AOI inspects solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Is said to be for high-volume or high-mix manufacturing environments; also for pre/post-reflow applications. Has four oblique viewing cameras; offers inspection for R-nets. Improved Fusion lighting, with multi-color solder joint inspection, reportedly delivers 20% higher detection capabilities compared to previous models. Offers offline programming and a standard package library. Real-time SPC monitoring is standard.

YESTech Inc., www.yestechinc.com

The PC3200 series of fast-setting, one-component conductive adhesives is for connecting passive components and bare dies on lead frames and PCB substrates. Uses are said to include smart cards and flexible circuits found in camera phones, automotive or semiconductor applications. Is a one-part system that reportedly requires no premixing. Does not have to be stored below 40ºC, nor shipped in dry ice. Solvent-free and formulated for stencil print, screen printing or dispensing applications.

Heraeus Contact Materials Division, www.4cmd.com/circuitmaterials

The enhanced 4000HS High-Speed Bondtester includes high-speed trigger capture software and a rising table work holder for cold bump pull bondtesting. Provides energy measurements during bondtesting. Is JEDEC-compliant.

Dage Precision Industries Inc., www.dage-group.com

KIC Explorer 9 thermal profiler uses modern hardware and features a total of nine thermocouples using the standard type K TC connectors. The channel completes the range of compact profilers. Software is said to be easy to use. The optional auto-focus process optimization software automatically selects the best oven setup for each application.

KIC, www.kicthermal.com

Zestron DS 100 solvent-based defluxing agent is for water-free and low-temperature cleaning applications. Is designed to remove flux residues from assemblies, ceramic hybrids, power modules and leadframes in self-regenerative closed-loop cleaning systems. Is said to ensure extended bath life, short cycle times and residue-free drying. Is halogen-free; meets new RoHS and WEEE guidelines.

Zestron America, www.zestron.com

e.dot+ compact electric hot melt adhesive guns are said to offer a combination of accurate dot or bead placement, easy installation and quiet operation, while requiring minimal space for installation and service. Reportedly ideal for high-speed dotting applications. Operate in combination with a small diameter hose and an external gun driver, permitting direct plug-and-play connections between the adhesive melter, gun, driver and hose. Are said to have on-times as low as 0.4 ms, cycle rates as fast as 1.8 ms, and a service life in excess of 200 million cycles. Features a removable armature and seat, and a number of interchangeable nozzles. Manual stroke adjustment permits re-zeroing of the module after servicing.

Nordson Corp., www.nordson.com